Abstract: A material for forming electroless plate comprising a non-conductive base material and a catalyst adhering layer provided on the non-conductive base material is constituted so that the catalyst adhering layer should comprise a hydrophilic (meth)acrylic resin constituted with a hydrophilic monomer and a hydrophobic monomer and containing the hydrophobic monomer at a ratio of 50 to 90 mol %. This material for forming electroless plate shows favorable catalyst adhering property, and shows no delamination of the catalyst adhering layer from the non-conductive base material, no dissolution of the catalyst adhering layer into a plating solution, and no discoloration of plate layer during the catalyst adhering step, development step and other steps.

Abstract: A material for electroless plating shows good adhesion for a catalyst and does not cause delamination of a catalyst adhering layer from a non-conductive base material in a catalyst adhering step, development step or other step. In a material for electroless plating, having a catalyst adhering layer on a non-conductive base material, the catalyst adhering layer is formed from a hydrophilic and/or water-soluble resin containing hydroxyl group, and a curable layer formed from a resin having hydroxyl group and an isocyanate type compound is provided between the base material and the catalyst adhering layer. The catalyst adhering layer is preferably formed while isocyanate groups of the isocyanate type compound in the curable layer remain.