Abstract: A multiple-pin terminal adapter comprising a substrate and a multiplicity of electrical contact pins extending from above and below the substrate for connection with printed circuit boards. A first group of contact pins extend downwardly for connection with the underlying printed circuit board, while a second group of contact pins extend upwardly out of axial alignment with the first group to assume a generally meander or otherwise random formation whereby adjacent contact pins in the second group are spaced a sufficient distance apart from one another to facilitate access for solder connection. A relay socket means is also provided for use in combination with the terminal adapter to provide easy access for connection to printed circuit boards packed with high density electrical components.