Abstract: A lamp assembly for mounting to a substrate having a housing formed, such as by molding, of a translucent silicone rubber with a cavity formed therein for receiving a miniature incandescent lamp with the leads thereof bent into the mounting plane to enable the lead to be utilized for mechanical and electrical bonding to the substrate. In one embodiment the housing has an enlarged base with a peripheral generally planar lip providing a pick-up surface for vacuum type tools. The base may be generally circular in cross-section with opposing sides of the peripheral flattened to provide indexing surfaces for mechanical orientation and handling devices. The enlarged base may be oval-shaped in cross-section and provided with spacing means adjacent the cavity, or may be rectangular in cross-section with V-shaped cut-outs on opposite edges for enabling protrusion of the leads into the slots so formed, thus providing protection for the leads during handling.