Abstract: A multi-layer circuit board comprised of two or more circuit board substrates shaped by injection molding with mating interconnecting pins and holes and banded together with an electrically insulating adhesive material. Circuit leads are provided on both sides of each substrate recessed into channels formed in the surface of the substrate during the molding process. Electrical interconnection of the layers of circuitry occurs where the conductive materials of the circuit leads passes down through component lead holes axially located in the interconnecting pins and around the exterior of the interconnecting pins where contact is made with the conductive material coating on the interior of the interconnecting holes.