Patents Assigned to Johnson Matthey Electonics, Inc.
  • Hot pressed and sintered sputtering target assemblies and method for making same
    Patent number: 5863398
    Abstract: Described is a hot pressed and sintered sputtering target assembly formed of hot pressed and sintered metal powder diffusion bonded together and to a backing plate by use of an intermediate adhesion layer of titanium or titanium alloy.
    Type: Grant
    Filed: October 11, 1996
    Date of Patent: January 26, 1999
    Assignee: Johnson Matthey Electonics, Inc.
    Inventors: Janine K. Kardokus, Diana Morales