Patents Assigned to KA IMAGING INC.
  • Publication number: 20220260505
    Abstract: A method and system of inspecting pre-molded parts comprising sealant material are disclosed. The method includes directing a micro-focused X-ray beam through a pre-molded sealant part comprising a sealant material to produce a phase-shifted refracted X-ray beam, and detecting the refracted X-ray beam with at least one phase contrast imaging X-ray detector to produce an image of the sealant material. The system includes at least one X-ray source structured and arranged to direct a micro-focused X-ray beam through a pre-molded sealant part comprising a sealant material to produce a phase-shifted refracted X-ray beam, and at least one phase contrast imaging X-ray detector structured and arranged to detect the refracted X-ray beam to produce an image of the sealant material.
    Type: Application
    Filed: June 10, 2020
    Publication date: August 18, 2022
    Applicants: PRC-DESOTO Intemational, Inc., KA Imaging Inc.
    Inventors: Soccorso Rizzello, Karim Sallaudin Karim, Christopher Charles Scott
  • Patent number: 11271030
    Abstract: A detection panel and a manufacturing method thereof are disclosed. The detection panel includes a first substrate and a second substrate, and the first substrate includes a light detection layer; the second substrate includes a drive circuit; the first substrate and the second substrate are opposite to each other for cell assembly, and the drive circuit is coupled to the light detection layer to read a photosensitive signal generated by the light detection layer.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: March 8, 2022
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., KA IMAGING INC.
    Inventors: Gang Hua, Chuncheng Che, Cheng Li, Jian Wang, Yanna Xue, Yong Zhang, Chia Chiang Lin
  • Patent number: 10914689
    Abstract: A phase contrast X-ray imaging system for imaging an object including an X-ray source; and an X-ray detector having a 25 micron or less pixel pitch; wherein a distance between the X-ray source and the object is less than or equal to 10 cm.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: February 9, 2021
    Assignee: KA IMAGING INC.
    Inventors: Karim S. Karim, Christopher C. Scott
  • Patent number: 10856826
    Abstract: The disclosure is directed at a method and apparatus for determining virtual outputs for a multi-energy x-ray apparatus. Based on the application that the x-ray apparatus is being used for, a general algorithm can be determined or selected. Inputs received from the x-ray apparatus can be substituted into the general algorithm to generate a virtual output algorithm for the x-ray apparatus. Virtual outputs can then be calculated using the virtual output algorithm.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: December 8, 2020
    Assignee: KA IMAGING INC.
    Inventors: Karim S. Karim, Sebastian Lopez Maurino, Sina Ghanbarzadeh
  • Patent number: 10627530
    Abstract: This method and system provide an imaging system for producing static and dynamic images from electromagnetic radiation such as x-rays and high-energy electrons. The detector includes a top electrode layer, a photoconducting layer and a bottom electrode layer. Within the bottom electrode layers are a set of pixel circuits for sensing the radiation. The photoconducting layer has a thickness at least three times greater than the pitch of one of the individual pixel circuits.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: April 21, 2020
    Assignee: KA IMAGING INC.
    Inventors: Karim S Karim, Chris Scott, Yunzhe Li
  • Patent number: 10622388
    Abstract: Disclosed are an array substrate, a manufacturing method thereof, a sensor and a detection device. The array substrate includes: a base substrate; a thin-film transistor (TFT) being disposed on the base substrate and including a source electrode and an active layer; a passivation layer disposed on the TFT; a first metal layer disposed on the passivation layer; an insulating layer disposed on the first metal layer; a through hole structure running through the insulating layer, the first metal layer and the passivation layer; and a detection unit being disposed on the insulating layer and including a second metal layer, wherein the second metal layer makes direct contact with the source electrode via the through hole structure.
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: April 14, 2020
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., KA IMAGING INC.
    Inventor: Chia Chiang Lin
  • Patent number: 10514471
    Abstract: The disclosure is directed at a detector element that includes a conductive shield electrode, or shield electrode layer that can assist in reducing breakdown and also improve the reliability of the detector element. The detector element includes a substrate layer that supports at least two electrodes and a semiconducting layer. A shield electrode layer is deposited or patterned adjacent at least one of the two electrodes.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: December 24, 2019
    Assignee: KA IMAGING INC.
    Inventors: Karim S. Karim, Sina Ghanbarzadeh
  • Patent number: 10269837
    Abstract: A sensor, a manufacturing method thereof and an electronic device. The sensor includes: a base substrate; a thin-film transistor (TFT) disposed on the base substrate and including a source electrode; a first insulation layer disposed on the TFT and provided with a first through hole running through the first insulation layer; a conductive layer disposed in the first through hole and on part of the first insulation layer and electrically connected with the source electrode via the first through hole; a bias electrode disposed on the first insulation layer and separate from the conductive layer; a sensing active layer respectively connected with the conductive layer and the bias electrode; and an auxiliary conductive layer disposed on the conductive layer. The sensor and the manufacturing method thereof improve the conductivity and ensure normal transmission of signals by arranging the auxiliary conductive layer on the conductive layer without addition of processes.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: April 23, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., KA IMAGING INC.
    Inventor: Chia Chiang Lin
  • Patent number: 10224353
    Abstract: Disclosed are an array substrate, a manufacturing method thereof, a sensor and a detection device. The array substrate includes: a base substrate; a thin-film transistor (TFT) being disposed on the base substrate and including a source electrode and an active layer; a passivation layer disposed on the TFT; a first metal layer disposed on the passivation layer; an insulating layer disposed on the first metal layer; a through hole structure running through the insulating layer, the first metal layer and the passivation layer; and a detection unit being disposed on the insulating layer and including a second metal layer, wherein the second metal layer makes direct contact with the source electrode via the through hole structure.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: March 5, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., KA IMAGING INC.
    Inventor: Chia Chiang Lin
  • Patent number: 9698193
    Abstract: A system and method for a multi-sensor pixel architecture for use in a digital imaging system is described. The system includes at least one semiconducting layer for absorbing radiation incident on opposites of the at least one semiconducting layer along with a set of electrodes on one side of the semiconducting layer for transmitting a signal associated with the radiation absorbed by the semiconducting layer.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: July 4, 2017
    Assignee: KA IMAGING INC.
    Inventors: Karim S. Karim, Sina Ghanbarzadeh