Abstract: It is a joining auxiliary agent for a polyamide resin with which a predetermined joining face of a polyamide resin molded article is coated to ensure the joining strength between the predetermined joining face and another polyamide resin when they are joined together, and has a composition containing a compound (1), which cleaves a hydrogen bond in the polyamide resin molded article while assisting the dissolution of the polyamide resin, in an organic solvent capable of dissolving the polyamide resin.
Type:
Grant
Filed:
December 18, 2003
Date of Patent:
September 15, 2009
Assignee:
Kabushiki Kaisha Katazen
Inventors:
Akihiro Yoshino, Kumeo Kondo, Koji Tomoda