Abstract: The invention provides an apparatus for the automatic soldering of hard metal teeth onto the prongs of a circular saw blade, in which the feed of the hard metal teeth and of the solder platelets, coated with fluxing agent and respectively to be arranged between a hard metal tooth and the associated prong of the circular saw blade, is managed in a linear arrangement by a single transport equipment conveying each time only one hard metal tooth and one solder platelet. This transport equipment first picks up the solder platelet, moves this over a fluxing agent coating station, then by its gripper device seizes a singled hard metal tooth and moves both into a soldering mount tooth pick up position, where first the hard metal tooth is picked up by a soldering mount gripper tongs, which is rectilinearly displaceable perpendicularly to the movement direction of the transport equipment and which is then pushed forward so far that the solder platelet can be laid onto the upper side of the hard metal tooth.