Abstract: A chemical mechanical polishing fastening device includes an annular base and a fastening ring. The annular base has a first combining plane, a first inner annular plane, a first jointing plane, and a second inner annular plane. The diameter of the first inner annular plane is greater than that of the second inner annular plane. Two sides of the first inner annular base are connected to the first combining plane and the first jointing plane. Two sides of the first jointing plane are connected to the first inner annular plane and the second inner annular plane. The fastening ring has a second combining plane and an inner annular flange protruded from the second combining plane. The inner annular flange has an outer annular wall to be combined with the first inner annular plane and a top plane to be combined with the first jointing plane.

Abstract: A chemical mechanical polishing fixture having lateral perforation structures includes: a holder and a retaining ring. The holder includes: an annular substrate, a plurality of third holes and a plurality of lateral perforation structures. The annular substrate has a first joint surface, an outer periphery and an inner periphery. The third holes are annularly arranged on the first joint surface, and each third hole includes a first inner thread structure for individually providing a screw to be locked to a semiconductor machine. The lateral perforation structures penetrate from the outer periphery to the inner periphery of the annular substrate, where the lateral perforations are selected from: a converse U-shaped cube structure, an converse U-shaped cube structure, a cuboid structure, a cylinder structure, an elliptic cylinder structure, a flat cuboid structure or a hybrid structure of at least one cuboid structure and the above.

Abstract: A chemical mechanical polishing fixture having lateral perforation structures includes: a holder and a retaining ring. The holder includes: an annular substrate, a plurality of third holes and a plurality of lateral perforation structures. The annular substrate has a first joint surface, an outer periphery and an inner periphery. The third holes are annularly arranged on the first joint surface, and each third hole includes a first inner thread structure for individually providing a screw to be locked to a semiconductor machine. The lateral perforation structures penetrate from the outer periphery to the inner periphery of the annular substrate, where the lateral perforations are selected from: a converse U-shaped cube structure, an converse U-shaped cube structure, a cuboid structure, a cylinder structure, an elliptic cylinder structure, a flat cuboid structure or a hybrid structure of at least one cuboid structure and the above.