Abstract: A test assembly contains a plurality of electronic devices that are attached to a lead frame. Leads of the electronic devices are trimmed from the lead frame to electrically isolate the leads. At least a portion of the lead frame is mounted into a socket in the test assembly.

Abstract: A semiconductor memory device includes an erase line, a common line, and a first transistor coupled between the conductive line and the common line. The memory device includes a plurality of memory cells and bit lines, each memory cell including a program line, a memory transistor, and a tunneling capacitor having a first node coupled to the floating gate. A second transistor is coupled between the program line and another node of the tunneling capacitor. An access transistor is coupled to the memory transistor and the bit line. The second transistor may be a depletion-type transistor, as may be the first transistor that is coupled to the erase line. The memory cell may also be implemented as a single-polysilicon memory structure.