Abstract: A reaction between epoxy-terminated polyamide and an acid anhydride compound can yield a modified polyamide resin, into resin skeleton of which carboxy groups to react with epoxy resin are introduced. An adhesive agent having excellent heat-resistance can be provided by the use of a composition of this modified polyamide resin and epoxy resin. Furthermore, an adhesive tape for a semiconductor device having excellent properties can be produced by laminating the adhesive agent and the protective layer on one surface of an organic insulated film.