Patents Assigned to Kaneka Japan Corporation - Justia Patents Search

Patents Assigned to Kaneka Japan Corporation

Polyimide resin and resin composition, adhesive solution, film-state joining component,and adhesive laminate film improved in moisture resistance using it, and production methods therefor

Patent number: 6693162

Abstract: The present invention provides a polyimide resin, a resin composition, an adhesive solution, a film-state joining component, and an adhesive laminate film soluble in a solvent having excellent heat resistance and adhesion, capable of bonding and curing at relatively low temperatures.

Type: Grant

Filed: October 9, 2001

Date of Patent: February 17, 2004

Assignee: Kaneka Japan Corporation

Inventors: Hiroyuki Tsuji, Hiroyuki Furutani, Koichiro Tanaka, Takeshi Kikuchi