Abstract: A film comprising a metal foil and a flexible epoxy resin layer covered therewith, wherein the flexible epoxy resin layer is formed from a flexible epoxy resin composition containing one or more polythiol compounds as a hardener, and a flexible printed wiring board produced therefrom.
Type:
Grant
Filed:
August 9, 1988
Date of Patent:
November 21, 1989
Assignee:
Kashima Industries Co.
Inventors:
Hideo Takimoto, Katsuji Tokuda, Koji Yamamoto