Abstract: Provided are a plating apparatus and a container bath, which have a simpler structure than a conventional system and are capable of improving uniformity of a plating thickness. The plating apparatus includes a plating tank which stores a plating liquid, an anode member arranged inside the plating tank, a plating object arranged inside the plating tank to face the anode member, a cathode jig which contacts with the plating object, and a space formed between the anode member and the plating object to be a flow passage to which the plating liquid flows from the plating tank. The plating liquid flows into the space from above relative to the space, and is sucked by a pump from below relative to the space.

Abstract: A process for efficiently producing a wiring board in which an insulating substrate 1 having a through hole 2 is used, which includes forming a seed layer 3 on one surface of the insulating substrate 1, covering the surface of the insulating substrate 1 on which the seed layer 3 is formed with a masking film 4, arranging the insulating substrate 1 and a positive electrode 5 so that the surface of the insulating substrate 1 opposite to the surface of the insulating substrate 1 on which the seed layer 3 of the insulating substrate 1 is formed is faced to the positive electrode 5, carrying out electroplating to form a metal layer 8 in the through hole 2, and then removing the masking film 4.

Abstract: A process for efficiently producing a wiring board in which an insulating substrate 1 having a through hole 2 is used, which includes forming a seed layer 3 on one surface of the insulating substrate 1, covering the surface of the insulating substrate 1 on which the seed layer 3 is formed with a masking film 4, arranging the insulating substrate 1 and a positive electrode 5 so that the surface of the insulating substrate 1 opposite to the surface of the insulating substrate 1 on which the seed layer 3 of the insulating substrate 1 is formed is faced to the positive electrode 5, carrying out electroplating to form a metal layer 8 in the through hole 2, and then removing the masking film 4.

Abstract: Provided are a plating apparatus and a container bath, which have a simpler structure than a conventional system and are capable of improving uniformity of a plating thickness. The plating apparatus includes a plating tank which stores a plating liquid, a cathode member arranged inside the plating tank, a plating object arranged inside the plating tank to face the cathode member, an anode jig which contacts with the plating object, and a space formed between the cathode member and the plating object to be a flow passage to which the plating liquid flows from the plating tank. The plating liquid flows into the space from above relative to the space, and is sucked by a pump from below relative to the space.

Abstract: The present invention provides a low-cost method for producing conductive particles in a short period of time by simplifying pretreatment in electroless plating. The method for producing conductive particles includes the steps of: introducing a solution composed mainly of palladium chloride and hydrochloric acid into an electroless plating bath containing particles of an organic material or an inorganic material while stirring the bath; and simultaneously applying an electroless plating to the surface of the particles and allowing the palladium catalyst to be carried on the surface of the particles to give conductive particles having an electroless plate coating.

Abstract: The present invention provides a low-cost method for producing conductive particles in a short period of time by simplifying pretreatment in electroless plating. The method for producing conductive particles includes the steps of: introducing a solution composed mainly of palladium chloride and hydrochloric acid into an electroless plating bath containing particles of an organic material or an inorganic material while stirring the bath; and simultaneously applying an electroless plating to the surface of the particles and allowing the palladium catalyst to be carried on the surface of the particles to give conductive particles having an electroless plate coating.

Abstract: In a hydrodynamic bearing apparatus for rotatably supporting a rotor by a hydrodynamic bearing, wear of the apparatus caused by sliding contact of dynamic pressure bearing faces in starting and stopping thereof is prevented to thereby promote durability, working of a dynamic pressure generating groove is facilitated and the bearing faces are prevented from being adsorbed to each other. By providing a low friction metal layer having water repellency at dynamic pressure bearing portions of a hydrodynamic bearing apparatus, friction can be reduced, wear or dust formation can effectively be restrained and the bearing faces can be prevented from being adsorbed to each other by dew condensation.

Abstract: A hydrogen storage material is disclosed with no collapse due to pulverization of hydrogen storage alloy particles by repeated hydrogen absorption and desorption thereby permitting repeated use while manifesting excellent electric and thermal conductivities. Pressure molding of hydrogen storage alloy particles, each being covered with a plated metal film having microgranules of a thermoplastic resin, at a temperature higher than a glass transition temperature or a melting point of and below a thermal decomposition temperature of the thermoplastic resin can produce a porous hydrogen storage material of hydrogen storage alloy particles being bonded to each other via the thermoplastic resin. The hydrogen storage material can become firm and strong because the plated metal films covering the hydrogen storage alloy particles are clasped with each other complexly.

Abstract: A hydrogen storage material is disclosed with no collapse due to pulverization of hydrogen storage alloy particles by repeated hydrogen absorption and desorption thereby permitting repeated use while manifesting excellent electric and thermal conductivities. Pressure molding of hydrogen storage alloy particles, each being covered with a plated metal film having microgranules of a thermoplastic resin, at a temperature higher than a glass transition temperature or a melting point of and below a thermal decomposition temperature of the thermoplastic resin can produce a porous hydrogen storage material of hydrogen storage alloy particles being bonded to each other via the thermoplastic resin. The hydrogen storage material can become firm and strong because the plated metal films covering the hydrogen storage alloy particles are clasped with each other complexly.

Abstract: There is provided a fluorocarbon compound-hydrogen storage alloy composite which has a sufficient water-repellent property and can efficiently absorb a hydrogen gas. The composite comprises hydrogen storage alloy particles which have a plated metal film covering at least a part of the particles, the plated metal film containing at least one fine particle of a fluorocarbon compound. Examples of the metal used for plating include Ni, Cu, Co, Ni-P, Ni-W, Ni-W-P, Ni-B, Ni-W-B, Cu-Ni, Cu-P, Co-P, Co-B, and Co-W. Polytetrafluoroethylene is preferably used for the fluorocarbon compound. The fluorocarbon compound hydrogen storage alloy composite is prepared by electrolytically plating the hydrogen storage alloy particles in a pyrophosphate bath with fine particles of a fluorocarbon compound dispersed therein.

Abstract: A method for producing a metal film resistor including at least an insulating substrate, a resistor film of copper-nickel alloy formed on the surface of the insulating substrate, and a pair of terminals which are in contact with the resistor film is provided. The method includes a step of depositing the copper-nickel alloy by electroplating from an aqueous pyrophosphate bath containing a copper salt and a nickel salt at a bath temperature of 20.degree.-40.degree. C. and a pH of 6-8.