Abstract: Optical inspection apparatus for detecting defects in a visually perceptible pattern including image acquistion means for inspecting the pattern on a pixel-by-pixel basis, developing digital data signals corresponding to each pixel and feeding the signals so developed to an imaging enhancement means. The imaging enhancement means compensates for equipment related degradations in the images and converts the digital data signal value corresponding to each pixel into a corrected signal value by operating on the digital data signal with a two dimensional finite impulse response filter. The corrected signal values of the image enhancement means are received by a defect detection means which evaluates the signal values for defects in the pattern. Any defects so determined are recorded and/or displayed on data recording means.

Abstract: An automatic semiconductor wafer inspection system including a wafer inspector, a system computer that performs movement and function control and data storage functions and a high speed image computer. Patterned wafers selected for inspection are automatically transported from cassette storage to a vacuum chuck located on the X-Y stage and positioned in a macro inspection station. The wafer is aligned and the surface illumination is changed to test for macro defects under different lighting conditions and levels of magnification. The reflected light is applied to a camera where the optical image is converted to an electrical representation thereof, stored, and then processed by the high speed image computer. After a wafer has been positioned and inspected in the macro inspection station at low magnification, it is moved by a macro-micro transport arm to the micro inspection station and a unique image previously found in the low power image is found again and used for initial alignment.

Abstract: An object mounting member is slideably interconnected with a guide member which provides a path between two separated fixed locations. The guide member is attached to a support member having fixed stops located between the two fixed locations. A pinion gear is fixedly attached to the shaft of a stepper motor, and a spur gear is held in an engaging relationship with said pinion gear. An eccentric arm is pivotally attached at one end to the spur gear and is driven to provide rapid motion between the two fixed locations with a rate of motion approaching zero hit nears each fixed location. The other end of the eccentric arm is pivotally attached to one end of a drive arm that is pivotally attached to the object mounting member. The drive arm includes a spring loaded member that is used to allow the object mounting member to be preloaded against a stop at each end of its travel.

Abstract: Apparatus 20 for inspecting photomasks 26 and the like by comparison of duplicate die patterns, including improved defect detection. Two-dimensional pixel representations of two die patterns are formed, with pixels having values or black or white or shades or grey, depending upon the features of the die patterns. Defects in the die patterns are found by a defect detector circuit 60 at points of non-agreement between the pixel representations. Two window matrices 130 and 134 of adjacent pixels are defined for corresponding areas of the two die patterns. The center matrix of each window matrix is defined as a comparison matrix 132 and 136. An error value is computed for subsets of the window matrix by summing the squares of the differences between each of the pixel values of each subset and the corresponding pixel values of the opposite comparison matrix. If there is no defect and any misalignment between the two representations minimal, at least one error value will be less than a threshold error value.

Abstract: An automatic patterned wafer inspection system includes macro and micro inspection stations having optical axes that are 10 inches apart on an X-Y crossed roller stage which provides 7 inches of travel in each of two directions along two orthogonal axes. A macro-micro transport arm is pivotally interconnected with the stage and supports a turntable with a vacuum chuck centrally located thereon. The transport arm is positioned to move the wafer from a position 5 inches to the left of center of the stage (the macro axis) to a position 5 inches to the right of the center of the stage (the micro axis). Repeatability of positioning of the arms is obtained by using a spring-loaded link to drive the transport arm against a hard stop located at the left and right of the stage. The turntable is mounted so as to have an outside edge adjacent the distal end of the transport arm. A vacuum chuck for holding the wafer is attached to the turntable.

Abstract: An automatic inspection system for inspecting holes in a mask including carriage means 30, illumination means 44, optical means 48, photosensitive detector means 46, and signal processing means 56. The mask 34 to be inspected is positioned by the carriage means in a horizontal plane. The optical means projects a focused image of a portion of the mask onto the photosensitive detector means. Photodiodes in the detector means are responsive to light from the illumination means that is transmitted through the holes in the mask. The signal processing means scans the outputs of the photodiodes and stores in memory a digital representation of the mask. The signal processing means performs inspection measurements and comparison tests. A smoothness checker circuit 240 measures the local radius of curvature of each hole at several places and compares the measurements to predetermined curvature limits to detect nicks and sharp protrusion defects.

Abstract: Defect detection apparatus including a mechanical and optical system for scanning duplicate areas of a photomask to be inspected, electronic means for converting the optically scanned information to digitized form, memory for storing such information, and means for comparing information obtained from one inspected area to the other inspected area to determine differences therebetween, such differences being classified as defects. The detection is accomplished using a vector gradient within a matrix technique to develop candidate and cancellor information which is then logically manipulated to qualify the data obtained from each pixel matrix and then, after qualification, is used to determine whether or not a defect has been detected. The subject invention has particular application to the detection of defects occurring at pattern corners within the inspected photomask and is specifically directed to overcoming difficulties previously encountered in detecting such defects.

Abstract: A method and apparatus for receiving two sets of digitized scan data from two optical detectors which simultaneously scan two supposedly identical portions of a photomask for comparing the two sets of scan data to detect defects, and for evaluating the defect data to determine whether or not it represents real defect information or false defect information. Scan lines containing defect data are scanned twice to produce two sets of defect data and the two sets are then compared to produce a real defect data set including only defects detected in both scans. False defects are thus eliminated from the final data set.

Abstract: Optical inspection apparatus for detecting differences between two dies in a photomask and including a carriage for supporting the objects to be inspected and for simultaneously moving such objects along an inspection path, an illuminator for illuminating corresponding portions of the objects as they are moved along the inspection path, electro-optical detectors for individually inspecting the illuminated portions and for developing first and second electrical signals respectively corresponding thereto, electronic memories for storing the first and second electrical signals, a computer for scanning the memories and for electronically aligning a readout of the first signal relative to a readout of the second signal, and a comparator for comparing the electronically aligned signals and for indicating any differences therebetween.

Abstract: Optical inspection apparatus for detecting differences between two dies in a photomask and including a carriage for supporting the objects to be inspected and for simultaneously moving such objects along an inspection path, an illuminator for illuminating corresponding portions of the objects as they are moved along the inspection path, electro-optical detectors for individually inspecting the illuminated portions and for developing first and second electrical signals respectively corresponding thereto, electronic memories for storing the first and second electrical signals, a computer for scanning the memories and for electronically aligning a readout of the first signal relative to a readout of the second signal, and a comparator for comparing the electronically aligned signals and for indicating any differences therebetween.