Abstract: An apparatus, a recording medium, and a method for generating a control parameter of a screen printer are disclosed. The apparatus includes a memory that stores a simulation model configured to derive predictive inspection information on a printed state of solder paste based on a plurality of control parameters of the screen printer; a communication circuit configured to receive first inspection information on a plurality of solder pastes printed by the screen printer based on a first control parameter, and a processor electrically connected to the memory and the communication circuit.

Abstract: According to the disclosure, an inspection apparatus determines whether a defect has occurred in a plurality of first inspection objects by comparing a reference range with the measurement value of the plurality of first inspection objects, identifies a plurality of second inspection objects in which a first error has occurred, and a plurality of third inspection objects in which a second error has occurred based on a result of determination whether the defect has occurred, adjusts the reference range based on measurement values of the plurality of second and third inspection objects, determines at least one of an occurrence probability of the first error and the second error based on the adjusted reference range, and displays at least one of a graph indicating the result of determination whether the defect has occurred, the adjusted reference range, the determined occurrence probability of the first error and the second error.

Abstract: A substrate inspection apparatus may include a communication circuit, a plurality of light sources, an image sensor, at least one memory, and at least one processor. The processor may be configured to generate pin insertion state information indicating an insertion state of each of a plurality of first pins by using a pattern light reflected from each of the plurality of first pins, detect at least one second pin having an insertion defect from among the plurality of first pins by using at least one of the pin insertion reference information and the pin insertion state information of each of the plurality of first pins, generate a control signal for adjusting at least one first process parameter among a plurality of process parameters of the pin insertion apparatus, and control the communication circuit to transmit the control signal to the pin insertion apparatus.

Abstract: The present disclosure proposes an inspection apparatus. The inspection apparatus may include: a structured-light source configured to sequentially radiate a plurality of structured lights having one phase range; a lens configured to adjust, for each of the plurality of structured lights, optical paths of light beams corresponding to phases of the phase range such that a light beam corresponding to one phase of the phase range arrives at each point of a partial region on an object; an image sensor configured to capture a plurality of reflected lights generated by the structured lights being reflected from the partial region; and a processor configured to acquire a light quantity value of the reflected lights; and derive an angle of the surface by deriving phase values of the reflected lights based on the light quantity value for the reflected lights.

Abstract: There is provided a technique that includes: a camera configured to capture images of the target object; a memory configured to store the images of the target object and feature data including one or more predetermined exterior features of the target object; and a processor configured to: determine a first process configuration for an operation including a plurality of image processes; perform the operation under the first process configuration; generate inspection data from the sets of images that have been processed; generate an inspection score by comparing the inspection data with the feature data; compare the inspection score with a predetermined threshold score; set the first process configuration as an optimal configuration if the inspection score satisfies the predetermined threshold score.

Abstract: A blood flow measurement device according to various embodiments may be configured to irradiate light to a first position of a subject and a second position of the subject located in a first direction with respect to the first position, acquire intensities of the reflected light at the first position and the second position, determine a first value which is a difference between the intensities of the reflected light at the first position and the second position, irradiate light to a third position of the subject located in a second direction with respect to the second position, acquire an intensity of the reflected light at the third position, determine a second value which is a difference between the intensities of the reflected light at the second position and the third position, and determine a blood flow direction based on the first value and the second value.

Abstract: A printed circuit board inspection apparatus can inspect the mounting state of a component by generating depth information on the component mounted on a printed circuit board by using a pattern of light reflected from the component and received by an image sensor, inputting the generated depth information into a machine-learning-based model, obtaining depth information with reduced noise from the machine-learning-based model, and using depth information with reduced noise.

Abstract: The apparatus according to various embodiments includes one or more processors, and one or more memories operatively connected to the one or more processors. The one or more memories may store instructions that, when executed, cause the one or more processors to acquire a plurality of first position offsets of a plurality of first components respectively mounted on a plurality of first substrates with respect to a plurality of pads of the plurality of first substrates corresponding to the plurality of first components from the optical measurement device, set a range of a normal state for a component position offset based on the plurality of first position offsets, generate a control signal for adjusting at least one control parameter of the component mounting device associated with a component mounting position based on the range of the normal state, and transmit the control signal to the component mounting device.

Abstract: The present disclosure provides an apparatus for determining mounting information. The apparatus according to the present disclosure may be configured to acquire solder measurement information indicating a state of a solder printed on a first substrate, determine whether or not the state of the solder is changed from states of solders printed on second substrates, which are measured prior to measurement of the first substrate, based on the solder measurement information, upon the determination that the state of the solder is not changed, determine mounting information indicating a mounting condition for mounting a first component on the first substrate using one or more models, and deliver the mounting information to a mounter. The one or more models may be configured to output the mounting information based on a correlation between states of a second component before and after a reflow process for each of the second substrates.

Abstract: A transfer apparatus for an inspection apparatus according to one embodiment of the present disclosure includes: an upper end engaging portion configured to make contact with an upper surface of a transferred article; a support frame to which the upper end engaging portion is fixed; a lift including a support part configured to support a lower surface of the transferred article, the lift arranged on the support frame to be movable in an up-down direction; and a lifting driver configured to provide a driving force to move the lift in the up-down direction.

Abstract: An inspection apparatus according to one embodiment of the present disclosure is configured to inspect an inspection object seated on a jig, the jig capable of being introduced into and withdrawn from the inspection apparatus. The inspection apparatus includes: a mover configured to move the jig; and a clamping driver configured to contact and press the jig, the clamping driver including a pressing portion configured to be movable in a clamping direction and an unclamping direction opposite to the clamping direction.

Abstract: An optical tracking system may comprise a reference marker unit stationarily disposed relative to a patient, a shape measurement unit configured to measure the three-dimensional shape of a specified part of the patient corresponding to a three-dimensional image, a tracking sensor unit configured to sense the reference marker unit and the shape measurement unit, and a processing unit. The processing unit may acquire a coordinate transformation relationship between the reference marker unit and the tracking sensor unit and a coordinate transformation relationship between the shape measurement unit and the tracking sensor unit based on a sensing result of the tracking sensor unit, acquire a coordinate transformation relationship between the specified part of the patient and the shape measurement unit based on a measurement result of the shape measurement unit, and define a coordinate system of the patient relative to the reference marker unit from the acquired coordinate transformation relationships.

Abstract: There is provided a technique that includes: a camera configured to capture images of the target object; a memory configured to store the images of the target object and feature data including one or more predetermined exterior features of the target object; and a processor configured to: determine a first process configuration for an operation including a plurality of image processes; perform the operation under the first process configuration; generate inspection data from the sets of images that have been processed; generate an inspection score by comparing the inspection data with the feature data; compare the inspection score with a predetermined threshold score; set the first process configuration as an optimal configuration if the inspection score satisfies the predetermined threshold score.

Abstract: A biological tissue inspection apparatus is disclosed. The biological tissue inspection apparatus comprises a stage and a probe. The probe comprises an optical imaging device, an optical interference detector, and a light guide. The probe acquires data regarding optical images and optical interference, through the optical imaging device and the optical interference detector. The stage or the probe moves such that a selected area of the inspection object is positioned in the FOV of the optical imaging device and of the optical interference detector. The light guide is configured such that illumination light from the optical imaging device and measurement light from the optical interference detector are coaxially emitted to the inspection object.

Abstract: A medical arm assembly according to embodiments disclosed includes: a remote joint where a remote point spaced forward from a reference point is located; a positioning arm section configured to support the remote joint, move the remote joint that a relative position of the remote point with respect to the reference point is changed in forward-and-rearward direction and upward-and-downward direction, and fix the relative position of the remote point with respect to the reference point; an operating arm section connected to the remote joint and configured to fix a surgery tool, rotate the surgery tool about a remote-rotation axis through the remote point in left-and-right direction, and move the surgery tool in a direction perpendicular to the remote rotation axis and through the remote point; and an arm supporting section where the positioning arm section and the operating arm section are supported by connecting and the reference point is located.

Abstract: An apparatus that communicates with a screen printer and a solder inspection device is disclosed. The apparatus according to the present disclosure may include a process that is configured to: obtain first information associated with each of a plurality of pads on the substrate; obtain second information associated with each piece of the solder paste applied to each of the plurality of pads from the solder inspection device; determine a position correction value for the stencil mask with respect to the substrate based on the first information and the second information; and deliver the position correction value to the screen printer.

Abstract: A printed circuit board inspection apparatus can inspect a mounting state of a component by generating depth information on the component by using a pattern of light reflected from the component mounted on a printed circuit board received by an image sensor, generating two-dimensional image data for the component by using at least one of light of a first wavelength, light of a second wavelength, light of a third wavelength, and light of a fourth wavelength reflected from the component received by a first image sensor, inputting the depth information and the two-dimensional image data for the component into a machine learning-based model, obtaining depth information with reduced noise from the machine learning-based model, and using the noise-reduced information.

Abstract: The present disclosure provides an apparatus. The apparatus according to the present disclosure comprises: at least one first light source configured to irradiate illumination light to an object on a reference surface; at least one second light source configured to irradiate pattern light to the object, a plurality of cameras configured to capture one or more illumination images and one or more pattern images; and one or more processors configured to determine a plurality of outlines indicating edges of the object based on two or more images captured in different directions among the one or more illumination images and the one or more pattern images; determine a virtual plane corresponding to an upper surface of the object based on the plurality of outlines; and determine an angle between the virtual plane and the reference plane.

Abstract: An electronic apparatus including a display and one or more processor is disclosed. The one or more processor is configured to: divide a first error value of each of a plurality of first components with respect to a mounting position acquired through inspection of a plurality of substrates of a first type, into a plurality of error values, generate a graph of a tree structure including a plurality of nodes corresponding to the plurality of first components, component types of each of the plurality of first components and a plurality of components included in a mounter, adjust attributes of each of the plurality of nodes using the plurality of error values divided from the first error value of each of the plurality of first components, and display the graph in which the attributes of each of the plurality of nodes are adjusted, on the display.

Abstract: An optical tracking system may comprise a reference marker unit stationarily disposed relative to a patient, a shape measurement unit configured to measure the three-dimensional shape of a specified part of the patient corresponding to a three-dimensional image, a tracking sensor unit configured to sense the reference marker unit and the shape measurement unit, and a processing unit. The processing unit may acquire a coordinate transformation relationship between the reference marker unit and the tracking sensor unit and a coordinate transformation relationship between the shape measurement unit and the tracking sensor unit based on a sensing result of the tracking sensor unit, acquire a coordinate transformation relationship between the specified part of the patient and the shape measurement unit based on a measurement result of the shape measurement unit, and define a coordinate system of the patient relative to the reference marker unit from the acquired coordinate transformation relationships.