Abstract: A TOC component removing apparatus removes TOC components contained in ultrapure water or pure water. The apparatus includes a treatment tank into which the ultrapure water or the pure water is introduced, a plurality of spherical catalyst particles of which surfaces are photocatalyst, a tabular translucent holding body which holds the catalyst particles on one surface, and an ultraviolet-ray light source which is arranged near the translucent holding body and radiates ultraviolet rays with a wavelength of 254 nm.

Abstract: A TOC component removing apparatus of the present invention is for removing TOC components contained in ultrapure water or pure water, including a treatment tank 2 into which the ultrapure water or the pure water is introduced, a plurality of spherical catalyst particles 3 of which surfaces are photocatalyst, a tabular translucent holding body 4 which holds the catalyst particles 3 on one surface 31a, and an ultraviolet-ray light source 5 which is arranged near the translucent holding body 4 and radiates ultraviolet rays with a wavelength of 254 nm.

Abstract: A TOC component removing apparatus of the present invention is for removing TOC components contained in ultrapure water or pure water, including a treatment tank 2 into which the ultrapure water or the pure water is introduced, a plurality of spherical catalyst particles 3 of which surfaces are photocatalyst, a tabular translucent holding body 4 which holds the catalyst particles 3 on one surface 31a, and an ultraviolet-ray light source 5 which is arranged near the translucent holding body 4 and radiates ultraviolet rays with a wavelength of 254 nm.

Abstract: A TOC component removing apparatus of the present invention is for removing TOC components contained in ultrapure water or pure water, including a treatment tank 2 into which the ultrapure water or the pure water is introduced, a plurality of spherical catalyst particles 3 of which surfaces are photocatalyst, a tabular translucent holding body 4 which holds the catalyst particles 3 on one surface 31a, and an ultraviolet-ray light source 5 which is arranged near the translucent holding body 4 and radiates ultraviolet rays with a wavelength of 254 nm.

Abstract: This soldering iron cleaning apparatus comprises a main body having an introduction hole, a motor, a sensor mechanism which detects the insertion of the soldering head to the introduction hole and drives the motor, a cleaning member which removes solder remaining on the soldering head, a power transmission mechanism which drives the cleaning member by the driving force from the motor. The power transmission mechanism rotates the cleaning member, by the driving force of the motor, in such a way that the cleaning member scrapes the external surface of the soldering head from the base side to the tip side of the soldering head while turning the cleaning member around the soldering head.

Abstract: The present invention provides a method and a device capable of manufacturing spherical semiconductor crystals continuously without contamination. A bar-shaped semiconductor material 64a is connected to a supporting member (wire 50) and descends at a preset speed. The bar-shaped semiconductor material 64a is preheated by the preheating portion 56c of a heater 56 to a predetermined temperature. Afterward, the preheated bar-shaped semiconductor material 64a further descends, and the surface of the semiconductor material melts through heating of the melting portion 56d of the heater 56 to form liquid drops 64b. The liquid drops 64b accumulate at the lower end of the bar-shaped semiconductor material 64a and drop down by their own weights. The liquid drops 64b cool down during free fall and become solid spherical semiconductor crystals 64c without deformation. An impact absorbing material 62 absorbs the impact of the falling spherical semiconductor crystals 64c and retains them.