Patents Assigned to Komatsu Industrial Corp.
  • Die cushion device
    Patent number: 7287409
    Abstract: A die cushion device is comprised of die cushion modules which are independently movable and unitized. The individual die cushion modules are provided with a cushion pad, a servomotor, a power transmission mechanism, a power conversion mechanism and a guide member. By configuring in this way, the design of the die cushion is facilitated, a drive mechanism of the die cushion becomes compact, and the number of types of parts used is decreased.
    Type: Grant
    Filed: June 15, 2005
    Date of Patent: October 30, 2007
    Assignees: Komatsu Ltd., Komatsu Industrial Corp.
    Inventors: Kazuhiko Shiroza, Yukiyoshi Takayama, Hiroaki Honma, Seiji Seki