Abstract: An electronic circuit board includes an ink receiving layer formed from a resin composition containing a polyvinyl acetal resin as a main component, and an electronic circuit formed in a pattern from an electrically conductive ink. An electronic circuit board production method includes the steps of: applying a liquid resin composition containing a polyvinyl acetal resin as a main component to form a layer of the liquid resin composition; heat-drying the liquid resin composition to form an ink receiving layer; and forming an electronic circuit in a predetermined circuit pattern from an electrically conductive ink by a printing method or a transferring method.

Abstract: The present disclosure provides a printing plate capable of stably suppressing occurrence of a marginal phenomenon.

Abstract: The present disclosure provides a printing plate capable of stably suppressing occurrence of a marginal phenomenon.

Abstract: A reliable electronic circuit board is provided, which maintains the quality and electrical conduction of an electronic circuit thereof even if being produced at an ordinary temperature at an atmospheric pressure. The electronic circuit board includes an ink receiving layer formed from a resin composition containing a polyvinyl acetal resin as a main component, and an electronic circuit formed in a pattern from an electrically conductive ink. An electronic circuit board production method includes the steps of: applying a liquid resin composition containing a polyvinyl acetal resin as a main component to form a layer of the liquid resin composition; heat-drying the liquid resin composition to form an ink receiving layer; and forming an electronic circuit in a predetermined circuit pattern from an electrically conductive ink by a printing method or a transferring method.

Abstract: An electronic circuit board manufacturing method according to the present disclosure is a method of manufacturing an electronic circuit board including a substrate and an electronic circuit having a predetermined pattern, the electronic circuit being fixed on the substrate and being made from a nanoink composition containing metal particles. The method includes the steps of: causing a printing plate to hold a nanoink composition containing metal particles, the printing plate including an ink holding part formed on a surface thereof and having a predetermined pattern; bringing a surface of the substrate into intimate contact with the printing plate to transfer the nanoink composition held on the ink holding part onto the substrate; and drying the transferred nanoink composition in an environment of 40° C. or below in the atmosphere to fix the nanoink composition after the transfer step, thereby forming an electronic circuit having a predetermined pattern.

Abstract: A layer forming relief transferring and printing an application fluid applied on printing convex portions on a printing object, the layer forming relief including printing convex portions formed as a strip, and a plurality of micro-projections distributed on top faces of the printing convex portions so as to form a groove between adjoining micro-projections for retaining the application fluid.

Abstract: A printing plate includes, on the printing surface of a raised part, grooves passing through from one side to another thereof. Preferably, the grooves are parallel to each other and equally spaced apart. More preferably the raised part is in the shape of a nearly-rectangular frame, and the grooves are provided such that one side of the near-rectangle and the longitudinal direction of the grooves form an angle of 45°.

Abstract: A layer forming relief transferring and printing an application fluid applied on printing convex portions on a printing object, the layer forming relief including printing convex portions formed as a strip, and a plurality of micro-projections distributed on top faces of the printing convex portions so as to form a groove between adjoining micro-projections for retaining the application fluid.