Abstract: The assembly platform is provided with a heatable working surface allowing an equipping of printed circuit boards which can be temporarily mounted thereto. Individual devices or components, respectively, can be retrieved via a retrieving opening from a component storage rotary carousel including a plurality of compartments which components are placed thereafter on the printed circuit board. At a given time only one of the compartments is accessible. A heating chamber allows a preheating of the soldering paste of a setting of adhesives for mounted components prior to the soldering proper thereof. The equipped printed circuit board pretreated in the heating room is repositioned on the working surface for the final soldering. This assembly platform allows completing all equipping steps of the SMT-technique at one single operating station.