Abstract: An injection molding apparatus includes a nozzle which is directly connected to a mold for injecting a molding material into the mold. The mold defines at least one cavity in the shape of a element to be molded and at least one gate passage, each gate passage interconnecting a separate cavity with the nozzle. The shape of the gate passage permits a rapid curing of any residual molding material, and permits separation of the mold and the nozzle before the molding material in each cavity is cured. The nozzle is then used for a subsequent procedure or molding process while the molding material in the cavity cures. The nozzle defines a first bore and a second bore arranged longitudinally in sequence, and a side hole for introducing the molding material into the first bore. The nozzle includes a first plunger which is selectively reciprocally movable in the first bore, and a second plunger which is selectively reciprocally movable in the second bore and in a central bore defined in the first plunger.
Type:
Grant
Filed:
December 20, 1995
Date of Patent:
December 16, 1997
Assignees:
General Instrument Corporation of Delaware, Kras Asia Ltd
Inventors:
Eugene Chen, Hohn Jong Hsiung, Kuang Hann Lin, Wing Lun Wong, Boon Meng Chan
Abstract: Distortions of electrical leads projecting from an integrated circuit chip are corrected simultaneously instead of in sequence to prevent a corrected distortion from reappearing.Semiconductor components are manufactured by means of electrically conductive plastic tools instead of steel tools thereby greatly reducing the cost of manufacture and handling.
Type:
Grant
Filed:
May 26, 1992
Date of Patent:
April 12, 1994
Assignee:
Kras Asia Ltd.
Inventors:
Lawrence L. Plummer, Jr., Boon-Meng Chan, See-Lian Gan, Hok-Ming Chan