Abstract: An apparatus for controlling the temperature of an electronic device under test includes a thermal head having a temperature controlled surface for making thermal contact with the electronic device. The thermal head defines a flow channel for passage of a refrigerant fluid so as to cause transfer of thermal energy between the electronic device and the thermal head. A refrigeration system is connected in fluid communication with the flow channel of the thermal head to supply refrigerant fluid thereto. The refrigeration system includes a metering valve operative to regulate introduction of the refrigerant fluid into the thermal head. A controller is operative to control the metering valve for maintaining a predetermined temperature at the temperature controlled surface.

Abstract: An apparatus for cooling a computer's microprocessor includes a thermal housing having a receiving aperture in alignment with the microprocessor. A thermal head is inserted into and guided by the receiving aperture such that a cooled surface of the thermal head will be in thermal contact with the microprocessor. The thermal head defines a flow channel for passage of a refrigerant fluid so as to cause cooling at the cooled surface. A clamping arrangement is attached to the mounting structure to maintain the thermal head in operative position. The apparatus further includes a refrigeration system in fluid communication with the flow channel of the thermal head to supply refrigerant fluid thereto.

Abstract: An apparatus and method for controlling the temperature of an integrated circuit device includes a refrigerant system having a coolant loop containing refrigerant, an evaporator, a compressor, and a condenser. The condenser has a variable speed fan controlled to maintain the temperature of the refrigerant at a predetermined value. In a refrigeration system used to cool an integrated circuit device, a method for controlling refrigerant pressure by comparing the refrigerant temperature at a predetermined location to a predetermined value and varying the cooling applied to the condenser.

Abstract: An apparatus for cooling an integrated circuit device includes a sealed thermally insulated chamber containing the integrated circuit device. A cooling element is located in chamber and is in thermal contact with the integrated circuit device for cooling the device. The integrated circuit device is mounted in a socket having socket pins that extend through a heater board forming one side of the device to projecting exposed external end portions. A heating element in the form of a polymer thick film resistor is deposited on the heater board on the inside of the chamber in the vicinity of the socket pins. The heating element is activated as necessary by a thermostatic control circuit to maintain the temperature of the exposed external end portions of the socket pins above a predetermined threshold to prevent moisture condensation on the projecting portions of the pins.