Abstract: A surface image of a semiconductor wafer having a defect is picked up as a inspection image while a surface image of a semiconductor wafer having no defect is stored in an image memory as a reference image. A density difference image between the inspection image and the reference image. By extracting the defect in wiring and non-wiring regions from the density difference image, extract images are obtained. Two luminance information for wiring and non-wiring regions are obtained from extract images. Based on the luminance information, the type of the defect is determined and a production process where the defect has occurred is detect.

Abstract: An ion implantation apparatus and process for ion implantation which eliminates the deterioration of device characteristics in the ion implantation process to a trench capacitor of a DRAM and increases the beam current without deteriorating the device characteristics.A high current ion implanter includes an implantation chamber, and arranged in the following order: a bias plate, a secondary electron implantation cylinder and an extension cylinder. The extension cylinder is adjacent to the implantation chamber, held to ground potential, and has a length of 10 to 25 cm..