Patents Assigned to Kulicke & Soffa Investments, Inc.
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Patent number: 6534877Abstract: Methods of protecting from atmospheric contaminants, or removing atmospheric contaminants from, the bonding surfaces of copper semiconductor bond pads by coating a bond pad with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible during ball or wedge wire bonding to obtain metal-to-metal contact between the bonding surfaces and the wires bonded thereto. Coated semiconductor wafers are also disclosed.Type: GrantFiled: January 18, 2002Date of Patent: March 18, 2003Assignee: Kulicke & Soffa Investments, Inc.Inventors: Timothy W. Ellis, Nikhil Murdeshwar, Mark A. Eshelman
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Patent number: 6530148Abstract: The present invention provides a method for sanding heads of buckling beam probes while the probes are disposed within a probe assembly between a lower die and upper die. Sanding provides that all the probes within a probe assembly have the same total length from tip to head. The method calls for contacting the probe tips to a flat fiducial plate such as a glass plate to ensure that the probe tips are coplanar. Then, the heads are sanded to a plane which is parallel with the fiducial plate. Preferably, the heads are sanded by placing the assembly and fiducial plate onto a Z-stage capable of moving in a Z direction. The Z-stage is located under a top surface of a table having a hole directly above the Z-stage. Raising the Z-stage lifts the probe heads to extend above the top surface of the table. Then, an abrasive plate resting on the top surface of the table is rubbed on the heads. Material is removed from the heads until all the probes are the same length.Type: GrantFiled: May 26, 2000Date of Patent: March 11, 2003Assignee: Kulicke and Soffa Investments, Inc.Inventor: January Kister
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Patent number: 6529333Abstract: A method and system for providing different magnified images of an electronic device. The vision system has a first beamsplitter for receiving an image of the device illuminated by a light source, the beamsplitter providing multiple of images of the device; optical elements for receiving the plural images of the device, each of the optical elements magnifying the image by a predetermined magnification factor to produce more than one magnified images; and a second beamsplitter for receiving the magnified images and filtering out all but one of the magnified images based on a wavelength of the light source.Type: GrantFiled: September 24, 2001Date of Patent: March 4, 2003Assignee: Kulicke & Soffa Investments, Inc.Inventors: David T. Beatson, Christian Hoffman, Michael Woodward, Lawrence B. Brown
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Patent number: 6523733Abstract: A controlled attenuation bonding tool for bonding a fine wire to a substrate. The bonding tool comprises a first cylindrical section having a substantially uniform first diameter; a second cylindrical section having a first end coupled to an end of the first cylindrical section, the second cylindrical section having a substantially uniform second diameter less than the first diameter; and a third section having a predetermined taper, a first end of the third section coupled to an end of the second cylindrical section.Type: GrantFiled: February 28, 2001Date of Patent: February 25, 2003Assignee: Kulicke & Soffa Investments Inc.Inventors: Amir Miller, Gil Perlberg
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Patent number: 6525552Abstract: A probe apparatus is provided with a number of space transformer segments that are fixated such that probe offset due to warping is kept to a minimum. In a first embodiment, the space transformer segments are permanently fixated. In a second embodiment the space transformer segments are included together with correspondingly shaped sheath segments in probe modules that may be individually removed from the probe apparatus for a selective maintenance. As a result a large number of chips may be tested simultaneously without reducing the operational cycle interval of the probe apparatus.Type: GrantFiled: May 11, 2001Date of Patent: February 25, 2003Assignee: Kulicke and Soffa Investments, Inc.Inventor: January Kister
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Patent number: 6520400Abstract: A device and method for providing tension and a reserve wire reservoir to a bonding wire for use with a bonding machine. The device includes an outlet port providing fluid under pressure, and a surface along which the pressurized fluid flows in a direction away from the outlet port such that the bonding wire follows a path along the surface and the pressurized fluid places a uni-directional tension on the bonding wire while maintaining a reserve portion of wire in a slack loop.Type: GrantFiled: March 30, 2001Date of Patent: February 18, 2003Assignee: Kulicke & Soffa Investments, Inc.Inventor: John Ditri
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Patent number: 6497356Abstract: A controlled attenuation bonding tool for bonding a fine wire to a substrate. The bonding tool comprises a first cylindrical section having a substantially uniform first diameter and a second cylindrical section with a substantially uniform second diameter less than the first diameter. The second cylindrical section is coupled to an end of the first cylindrical section and has a planar area along at least a portion of a length of the second section.Type: GrantFiled: June 21, 2001Date of Patent: December 24, 2002Assignee: Kulicke & Soffa Investments, Inc.Inventors: Amir Miller, Gil Perlberg
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Publication number: 20020157657Abstract: A method and apparatus for cutting panels or wafers into rectangular shaped die. The apparatus includes a spindle; and a first blade having a first diameter and a second blade having a second diameter smaller that the first diameter each blade mounted to the spindle and spaced apart from one another. The first blade and second blades cut the workpiece based on a direction of movement of said workpiece relative to the first and second blades. The method includes the steps of mounting a first blade having a first diameter and a second blade having a second diameter smaller that the first diameter on a spindle; moving the workpiece relative to the first and second blades; cutting the workpiece along a first direction with the first blade; and cutting the workpiece along a second direction with both the first and second blades simultaneously.Type: ApplicationFiled: April 25, 2001Publication date: October 31, 2002Applicant: Kulicke & Soffa Investments Inc.Inventor: Eli Toledano
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Publication number: 20020139830Abstract: A device and method for providing tension and a reserve wire reservoir to a bonding wire for use with a bonding machine. The device includes an outlet port providing fluid under pressure, and a surface along which the pressurized fluid flows in a direction away from the outlet port such that the bonding wire follows a path along the surface and the pressurized fluid places a uni-directional tension on the bonding wire while maintaining a reserve portion of wire in a slack loop.Type: ApplicationFiled: March 30, 2001Publication date: October 3, 2002Applicant: Kulicke & Soffa Investment, Inc.Inventor: John Ditri
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Patent number: 6424164Abstract: An apparatus for electronically testing of bound electrical circuits connected to planar arrayed pads having removable mounted conductive beam probes to simplify the manufacturing and maintaining process. A space transformer comprises from outside electrically accessible conductive holes wherein the guided beam probes are friction resilient resting. In a second embodiment, the friction resilient resting induces a predetermined bending onto the beam probes. This is accomplished by offsetting guiding plates thus imposing a rotational urging on the probe neck within the conductive hole which is just a bare extension of the beam probe.Type: GrantFiled: June 13, 2000Date of Patent: July 23, 2002Assignee: Kulicke & Soffa Investment, Inc.Inventor: January Kister
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Patent number: 6420245Abstract: A method and apparatus for singulating semiconductor wafers is described. The method comprises the steps of aiming a laser beam at a layer placed over the substrate; absorbing energy from the laser beam into the layer; forming scribe lines in the layer by scanning the laser beam across the layer; and cutting through the substrate along the scribe lines with a saw blade to singulate the wafer. The apparatus includes a laser placed over the coating layer of the substrate, and a saw blade mounted over a surface of the substrate. The coating layer has a first absorption coefficient relative to a wavelength of the laser and the semiconductor substrate has a second absorption coefficient less than the first absorption coefficient. Energy from the laser beam is absorbed into the coating layer to form scribe lines therein, and the saw blade cuts through the substrate along the scribe lines.Type: GrantFiled: April 30, 2001Date of Patent: July 16, 2002Assignee: Kulicke & Soffa Investments, Inc.Inventor: Ran Manor
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Patent number: 6419500Abstract: The present invention provides a method for sanding heads of buckling beam probes while the probes are disposed within a probe assembly between a lower die and upper die. Sanding provides that all the probes within a probe assembly have the same total length from tip to head. The method calls for contacting the probe tips to a flat fiducial plate such as a glass plate to ensure that the probe tips are coplanar. Then, the heads are sanded to a plane which is parallel with the fiducial plate. Preferably, the heads are sanded by placing the assembly and fiducial plate onto a Z-stage capable of moving in a Z direction. The Z-stage is located under a top surface of a table having a hole directly above the Z-stage. Raising the Z-stage lifts the probe heads to extend above the top surface of the table. Then, an abrasive plate resting on the top surface of the table is rubbed on the heads. Material is removed from the heads until all the probes are the same length.Type: GrantFiled: March 8, 1999Date of Patent: July 16, 2002Assignee: Kulicke & Soffa Investment, Inc.Inventor: January Kister
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Patent number: 6420887Abstract: A space transformer made up of a primary structure that is fabricated from semiconductor body for retaining beam probes used for contacting the pads of a circuit or device under test. The primary structure is part of the space transformer and has vias that hold the beam probes, and a ceramic support structure to provide sufficient stiffness before bonding it to a secondary structure of the space transformer. The fabrication of the primary structure and its embedding within the secondary structure is performed in a manner analogous to the fabrication of circuit chips and its embedding within the packaging. As a result, down scaling in chip fabrication can be correspondingly applied to the fabrication of space transformers.Type: GrantFiled: June 13, 2000Date of Patent: July 16, 2002Assignee: Kulicke & Soffa Investment, Inc.Inventors: January Kister, Jean-Michel Jurin, Isabelle George
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Patent number: 6413576Abstract: Methods for protecting the surface of an uninsulated portion of a copper circuit from environmental contamination detrimental to joining the surface to another metal surface, said method comprising the step of coating the surface with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible when the surfaces are being joined to obtain metal-to-metal contact between the surfaces. Coated electronic packages including semiconductor wafers are also disclosed.Type: GrantFiled: October 5, 1999Date of Patent: July 2, 2002Assignee: Kulicke & Soffa Investments, Inc.Inventors: Timothy W. Ellis, Nikhil Murdeshwar, Mark A. Eshelman, Christian Rheault
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Patent number: 6412683Abstract: A vision system and method for use with a bonding tool that takes into account variations due to temperature changes and other nonrandom systemic effects. The vision system includes a cornercube offset tool having a plurality of total internal reflection surfaces, the cornercube offset tool located below the vision plane of the optical system; and an optical detector to receive an indirect image of the bonding tool through the cornercube offset tool. The method comprises the steps of providing a cornercube offset tool having a plurality of total internal reflection surfaces below a vision plane of the bonding tool; and receiving an indirect image of the bonding tool through the cornercube offset tool.Type: GrantFiled: July 24, 2001Date of Patent: July 2, 2002Assignee: Kulicke & Soffa Investments, Inc.Inventors: David T. Beatson, Christian Hoffman, James E. Eder, John Ditri
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Patent number: 6386433Abstract: An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrate. An energy source is directed through the capillary onto the solder to reflow the solder to the substrate. The apparatus provides for individual introduction of the solder material into the capillary and urging of the solder material from a reservoir to the capillary while preventing unintended jams and blockage of the solder material.Type: GrantFiled: August 11, 2000Date of Patent: May 14, 2002Assignee: Kulicke & Soffa Investments, Inc.Inventors: Eli Razon, Vaughn Svendsen, Robert Kowtko, Kyle Dury, Krishnan Suresh
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Patent number: 6354912Abstract: Two blades are arranged oppositely at a predetermined interval along the Y-axis. The two blades cut a wafer along two cutting lines at the same time while the two blades are moving along the X-axis. After the wafer is cut along these two cutting lines, the two blades are moved along the Y-axis by one pitch of the cutting lines so that the wafer can be cut along the next two cutting lines. This action is repeated to cut the wafer along the cutting lines continuously. This wafer cutting method can hold the movement of the blades along the X-axis to a minimum because of the oppositely-arranged two blades. Consequently, the wafer can be cut in a short period of time.Type: GrantFiled: December 2, 1998Date of Patent: March 12, 2002Assignees: Tokyo Seimitsu Co., Ltd., Kulicke & Soffa Investments, Inc.Inventors: Masateru Osada, Masayuki Azuma, Hirofumi Shimoda, Felix Cohen
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Patent number: 6354285Abstract: An attachment for a dicing saw having a housing, a carriage mounted in the housing, a bellows coupled to the carriage, and at least one drainage channel in the housing, the attachment including a collector for automatically collecting debris and fallen dice during operation of the dicing saw. There is also provided a method for cleaning a dicing saw having a housing, a carriage mounted in the housing, a bellows coupled to the carriage, and at least one drainage channel in the housing, the method including the steps of automatically collecting debris and fallen dice in a collector during operation of the dicing saw.Type: GrantFiled: April 11, 2000Date of Patent: March 12, 2002Assignee: Kulicke & Soffa Investments, Inc.Inventors: Oded Yehoshua Licht, Yaacov Lagerbaum
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Patent number: 6352743Abstract: Methods of protecting from atmospheric contaminants, or removing atmospheric contaminants from, the bonding surfaces of copper semiconductor bond pads by coating a bond pad with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible during ball or wedge wire bonding to obtain metal-to-metal contact between the bonding surfaces and the wires bonded thereto. Coated semiconductor wafers are also disclosed.Type: GrantFiled: June 11, 1999Date of Patent: March 5, 2002Assignee: Kulicke & Soffa Investments, Inc.Inventors: Timothy W. Ellis, Nikhil Murdeshwar, Mark A. Eshelman
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Patent number: D455625Type: GrantFiled: March 13, 2001Date of Patent: April 16, 2002Assignee: Kulicke & Soffa Investments, Inc.Inventor: Gideon Levinson