Abstract: A light-emitting module includes: (a) a liquid-crystal module containing a pair of transparent substrates and a liquid-crystal layer disposed between the pair of transparent substrates; (b) a first light-emitting diode (LED) component disposed on a first side of the liquid-crystal module; (c) a first transparent cover plate over the first LED component such that the first LED component is sandwiched between the liquid-crystal module and the first transparent cover plate; and (d) a control circuit configured to control an on/off frequency of the liquid-crystal module and a light-emitting frequency of the first LED component in such a manner that the light emitted from the first LED component is synchronously shielded by the liquid-crystal module, wherein the light is emitted from a side opposite to the liquid-crystal module.

Abstract: An embodiment of the present invention provides a light emitting device including: a transparent substrate; a wiring layer disposed on the transparent substrate; a plurality of light emitting diode chips disposed on the transparent substrate and electrically connected to the wiring layer; and an opposite substrate disposed on the transparent substrate to sandwich the light emitting diode chips and the wiring layer, wherein no wiring layer is disposed on a surface of the opposite substrate facing the light emitting diode chips.

Abstract: The subject invention relates to a light emitting device, including a first semiconductor layer having a first conductive type; a second semiconductor layer having a second conductive type, wherein the second conductive type is different from the first conductive type; and a passivation layer covering the first and the second semiconductor layers, wherein the passivation layer has a rough surface made from a roughing treatment. The subject invention further discloses a manufacturing method for such light emitting device. The structure of the light emitting device of the subject invention can eliminate unnecessary elements, reduce process time, facilitate control of light emitting shape and further improve light emitting efficiency.

Abstract: An embodiment of the present invention provides a light emitting device including: a transparent substrate; a wiring layer disposed on the transparent substrate; a plurality of light emitting diode chips disposed on the transparent substrate and electrically connected to the wiring layer; and an opposite substrate disposed on the transparent substrate to sandwich the light emitting diode chips and the wiring layer, wherein no wiring layer is disposed on a surface of the opposite substrate facing the light emitting diode chips.

Abstract: The subject invention relates to an illumination device, comprising a lamp holder having a base; and a plurality of LED dies directly bonded on the base. The structure of the illumination device of the subject invention can eliminate unnecessary elements, reduce process time and further improve lighting efficiency.

Abstract: A light-emitting device capable of producing white light includes at least two types of LED elements and at least one encapsulant material. Each of the LED elements has an epitaxial light-emitting layer grown on a substrate; and the epitaxial light-emitting layers for the LED elements are the same series of AlGaInN materials having emission wavelengths in a region from violet to green light and different from one another by at least 30 nm. The encapsulant material encapsulates the LED elements and contains an adequate amount of fluorescent powder, which can be excited to emit complementary color lights to mix with color lights from the LED elements to produce bluish, yellowish, greenish or reddish white light. At least two types of the white light-emitting devices can be differently arrayed in a module or a system to produce a white light with high color-rendering index and good light mixing effect.

Abstract: A light-emitting module is provided, including a heat sink and a plurality of insulating layers disposed over the heat sink. A plurality of light-reflective layers is disposed over one of the insulating layers, respectively, wherein the light-reflective layers comprise a plurality of light-reflective inclined surfaces. A plurality of conductive layers is disposed over one of the light-reflective layers, respectively. A light-emitting diode (LED) chip is disposed over the heat sink. A plurality of bonding wires is provided, connecting the LED chip with the conductive layers. A transparent housing is disposed over the LED chip. A phosphor layer is disposed over a surface of the transparent housing facing the heat sink, and does not physically contact the LED chip.