Patents Assigned to Kunshan Jue-Choung Electronics Co., Ltd.
  • Patent number: 8550148
    Abstract: A structure of heat plate with clip includes a heat plate and at least one clip. The heat plate is a hollow body having an interior cavity containing a capillary structure and a working fluid. The heat plate has a surface forming a receiving chamber. The clip is a resilient plate having mounting sections, which are mounted to the heat plate. The mounting sections have a portion received in the receiving chamber. In this way, replacement of inside-cavity supporting structure can be realized and advantages of thinned structure, flexible adjustment of positioning, and being hard to cause stress induced deformation can be achieved.
    Type: Grant
    Filed: October 13, 2010
    Date of Patent: October 8, 2013
    Assignee: Kunshan Jue-Choung Electronics Co., Ltd.
    Inventors: Yu-Po Huang, Tung-Jung Kuo
  • Patent number: 8403032
    Abstract: A structure of heat plate includes a hollow portion formed adjacent to a side edge of a plate body or in a corner of the plate body. A seal tube is received in the hollow portion so that the plate body provides complete protection to the seal tube against deformation or damage of the seal tube caused by external impact or hit and offers the advantages of simple structure, excellent durability, being easy to practice, and flexibility of arrangement.
    Type: Grant
    Filed: December 31, 2009
    Date of Patent: March 26, 2013
    Assignee: Kunshan Jue-Choung Electronics Co., Ltd.
    Inventors: Yu-Po Huang, Tung-Jung Kuo
  • Publication number: 20120090824
    Abstract: A structure of heat plate with clip includes a heat plate and at least one clip. The heat plate is a hollow body having an interior cavity containing a capillary structure and a working fluid. The heat plate has a surface forming a receiving chamber. The clip is a resilient plate having mounting sections, which are mounted to the heat plate. The mounting sections have a portion received in the receiving chamber. In this way, replacement of inside-cavity supporting structure can be realized and advantages of thinned structure, flexible adjustment of positioning, and being hard to cause stress induced deformation can be achieved.
    Type: Application
    Filed: October 13, 2010
    Publication date: April 19, 2012
    Applicant: Kunshan Jue-Choung Electronics Co., Ltd.
    Inventors: Yu-Po Huang, Tung-Jung Kuo
  • Publication number: 20120031588
    Abstract: A structure of heat plate includes two boards, which mate and are coupled to each other to define therebetween an accommodation chamber and a plurality of capillary layers arranged in the accommodation chamber in such a way that the capillary layers are set on a common horizontal plane and the capillary layers form therebetween a plurality of passages. As such, the efficiency of diffusion of vapor of a working fluid is increased and the uniformity of distribution of the working fluid is improved, so that the efficiency of temperature reduction is improved.
    Type: Application
    Filed: August 5, 2010
    Publication date: February 9, 2012
    Applicant: Kunshan Jue-Choung Electronics Co., Ltd
    Inventors: Yu-Po Huang, Tung-Jung Kuo
  • Publication number: 20120031587
    Abstract: A heat plate includes two boards, which mate and are coupled to each other to define therebetween an accommodation chamber and a capillary structure of at least one first capillary layer and at least one second capillary layer arranged in the accommodation chamber in such a way that the first and second capillary layers are stacked over each other. With the arrangement of the first and second capillary layers, the efficiency of diffusion of vapor of a working fluid is increased and the uniformity of distribution of the working fluid is enhanced, so that the efficiency of temperature reduction is improved.
    Type: Application
    Filed: August 5, 2010
    Publication date: February 9, 2012
    Applicant: Kunshan Jue-Choung Electronics Co., Ltd.
    Inventors: Yu-Po Huang, Tung-Jung Kuo
  • Publication number: 20110240256
    Abstract: A mounting structure is provided for a heat dissipater, including a heat plate having a surface on which a radiator is positioned. A plurality of retention members is set on side margin portions of the surface of the heat plate. The retention members are secured to the heat plate in a locked manner, so that the retention members help spreading stress to realize stable and secure mounting and enhance the performance of heat transfer.
    Type: Application
    Filed: April 6, 2010
    Publication date: October 6, 2011
    Applicant: Kunshan Jue-Choung Electronics Co., Ltd.
    Inventors: Yu-Po Huang, Tung-Jung Kuo
  • Publication number: 20110155350
    Abstract: A structure of heat plate includes a hollow portion formed adjacent to a side edge of a plate body or in a corner of the plate body. A seal tube is received in the hollow portion so that the plate body provides complete protection to the seal tube against deformation or damage of the seal tube caused by external impact or hit and offers the advantages of simple structure, excellent durability, being easy to practice, and flexibility of arrangement.
    Type: Application
    Filed: December 31, 2009
    Publication date: June 30, 2011
    Applicant: Kunshan Jue-Choung Electronics Co., Ltd.
    Inventors: Yu-Po Huang, Tung-Jung Kuo