Patents Assigned to KUNSHAN TELINK SEMICONDUCTOR CO., LTD.
  • Patent number: 11381976
    Abstract: Disclosed is a pairing method and a pairing system for a wireless headset, the pairing method comprising: establishing, by an intermediate device, wireless communication connections respectively with a first wireless earpiece and a second wireless earpiece, and sending pairing information respectively to the first wireless earpiece and the second wireless earpiece based on the established wireless communication connections; and establishing, by the first wireless earpiece and the second wireless earpiece, a wireless communication link between the first wireless earpiece and the second wireless earpiece based on the pairing information. By the above pairing method, pairing between the first wireless earpiece and the second wireless earpiece can be realized conveniently.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: July 5, 2022
    Assignee: Kunshan Telink Semiconductor Co., Ltd.
    Inventors: Mingjian Zheng, Haipeng Jin
  • Patent number: 11246022
    Abstract: Disclosed is a Bluetooth headset device and a communication method for the same. The method comprises: establishing by a first earpiece serving as a Bluetooth master device a Bluetooth connection with a data source device; establishing by the first earpiece and a second earpiece a wireless connection therebetween; and according to a preset cyclicity, exchanging by the first and second earpieces control information within a first time period, sending by one of the first and second earpieces that serves as a primary earpiece a Bluetooth transmission request to the data source device, and receiving by the first and second earpieces simultaneously Bluetooth data sent by the data source device in response to the request, within a second time period, wherein the role of the primary earpiece is switched between the first and second earpieces in an alternate mode or a switching on-demand mode based on the control information.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: February 8, 2022
    Assignee: KUNSHAN TELINK SEMICONDUCTOR CO., LTD.
    Inventors: Mingjian Zheng, Haipeng Jin