Patents Assigned to Kyosei Co., Ltd.
  • Conductive Member Using Copper-Silver Alloy, Contact Pin and Device
    Publication number: 20210088552
    Abstract: The present invention focuses on a material constituting a contact pin and a processing technique of the material, and is directed to manufacturing a conductive member by using a material and a processing technique which are different from those in the related art. The conductive member is obtained by applying etching treatment to a copper-silver alloy including copper and silver while using at least copper alloy etching liquid, but silver etching liquid may also be selectively added to the copper alloy etching liquid.
    Type: Application
    Filed: July 9, 2018
    Publication date: March 25, 2021
    Applicants: Kyosei Co., Ltd., National Institute of Materials Science
    Inventors: Tsutomu SATO, Yoshikazu SAKAI, Akihiro KIKUCHI