Patents Assigned to Kyowa Machine Co., Ltd.
  • Patent number: 7114360
    Abstract: A plate bending machine for bending a plate clamped between a lower die and a pressure die by a blade of a bending die mounted on a bend beam which is controlled in the vertical and horizontal directions. The bend beam has a vertical cross-section of substantially C-shaped configuration, and includes a first bending die attached to an upper portion of the substantially C-shaped configuration and a second bending die attached to a lower portion of the same. Blades are formed on at least one of the first and second bending dies to extend in the upward and downward directions, respectively. The horizontal bend arm may be connected to one end of a vertical bend arm which is disposed substantially vertically, by a shaft B (eccentric shaft).
    Type: Grant
    Filed: June 2, 2005
    Date of Patent: October 3, 2006
    Assignee: Kyowa Machine Co., Ltd.
    Inventor: Toshio Ikeda
  • Publication number: 20050268683
    Abstract: A plate bending machine for bending a plate clamped between a lower die and a pressure die by a blade of a bending die mounted on a bend beam which is controlled in the vertical and horizontal directions. The bend beam has a vertical cross-section of substantially C-shaped configuration, and includes a first bending die attached to an upper portion of the substantially C-shaped configuration and a second bending die attached to a lower portion of the same. Blades are formed on at least one of the first and second bending dies to extend in the upward and downward directions, respectively. The horizontal bend arm may be connected to one end of a vertical bend arm which is disposed substantially vertically, by a shaft B (eccentric shaft).
    Type: Application
    Filed: June 2, 2005
    Publication date: December 8, 2005
    Applicant: KYOWA MACHINE CO., LTD.
    Inventor: Toshio Ikeda
  • Patent number: 6662619
    Abstract: A mold clamping device for a pressing machine which bends a plate material inserted between upper and lower molds. The mold clamping device comprises a main frame (1) of integral structure, a holding ram (13) mounted on the upper half of the mainframe (1) and for supporting the upper mold (8) for vertical movement, a pair of arch-type thick springs (6) vertically mounted on the upper half of the main frame, and a crank mechanism (10) with which the upper end of each of the arch-type thick spring is connected through a crank pin (17). The crank mechanism creates a rotational force at a position near the dead center of the crank pins (17). This rotational force resiliently deforms the arch-type thick springs (6) which in turn create a resilient force for pressing the upper mold (8) against the lower mold (9). This provides an accurate and stable clamping force between the upper and lower molds.
    Type: Grant
    Filed: October 12, 2001
    Date of Patent: December 16, 2003
    Assignee: Kyowa Machine Co., Ltd.
    Inventor: Toshio Ikeda