Patents Assigned to LASER ENGINEERING APPLICATIONS
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Patent number: 11928401Abstract: A method for simulating laser machining of a material by a laser machining system comprising the following steps: providing a central unit with: information relating to the material to be machined: delta ?, threshold fluence, incubation coefficient S, complex refractive index n+ik, information about the laser processing system: information relating to a polarization, pulse energy EP, diameter of said machining laser beam at a focal point w, order of a Gaussian p, pulse repetition rate PRR n, wavelength; determining with said central unit on the basis of the information relating to said material to be machined and the laser machining system, a machining profile in two dimensions corresponding to the simulation of a machining of said material to be machined with said laser machining system.Type: GrantFiled: January 25, 2019Date of Patent: March 12, 2024Assignee: LASER ENGINEERING APPLICATIONSInventors: David Bruneel, Liliana Cangueiro, Paul-Etienne Martin, José-Antonio Ramos De Campos, Axel Kupisiewicz
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Patent number: 11498286Abstract: A system for holding a workpiece in position and exposing it to laser radiation, such that: the workpiece includes a bottom surface and a top surface that are electrically insulated from each other. The system includes an electrostatic charge generating device for generating electrostatic charges on the top surface; an electrically conductive support for forming, on the bottom surface, electrostatic charges of opposite sign to those generated on the top surface; and a laser device for machining or welding. The electrostatic charge generating device is arranged to be activated before or during the laser machining or welding, such that the workpiece is held in position relative to the electrically conductive support during the machining or welding thereof.Type: GrantFiled: July 16, 2019Date of Patent: November 15, 2022Assignee: LASER ENGINEERING APPLICATIONSInventors: Marc Décultot, Anne Henrottin, Jérôme Patars, Jose-Antonio Ramos De Campos, Axel Kupisiewicz
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Patent number: 11344970Abstract: An optical device for detecting the drift of a light beam of a laser machining system includes a beam splitter for obtaining a first light beam along a first optical path and a second light beam along a second optical path. The optical device further includes a focal module positioned at least partially along the first optical path to obtain a focused light beam that is directed towards a first light beam matrix detection means positioned in a focusing plane associated with the focal module. The optical device also includes an afocal module positioned at least partially along the second optical path to obtain a collimated light beam that is directed towards a second light beam matrix detection means.Type: GrantFiled: March 25, 2019Date of Patent: May 31, 2022Assignee: LASER ENGINEERING APPLICATIONSInventors: Sébastien Estival, Paul-Etienne Martin
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Patent number: 11292084Abstract: A method of assembling a substrate with a part is provided. The method includes a step of structuring the substrate by a pulsed laser. In one example, the substrate is metallic and the part is polymer-based. The structuring step engraves grooves into the substrate in a pattern determined by the relative motion of the beam and the substrate. The pattern is configured to provide improved adhesion between the structured substrate and a part after assembling the substrate and the part by laser welding. The method of assembling may further include a pre-treatment step of the structured surface to allow improve laser absorption during the welding assembling.Type: GrantFiled: April 26, 2017Date of Patent: April 5, 2022Assignee: LASER ENGINEERING APPLICATIONS S.A.Inventors: Anne Henrottin, Jose Antonio Ramos de Campos, Axel Kupisiewicz, Gabriel Morales Cid, Rafael González Higueras, Francisco Javier Navas Martos
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Patent number: 11267072Abstract: Method for structuring a substrate (11) and comprising the following steps: —providing a device (100) comprising a light source (33), an optical system (2) for obtaining an outgoing light beam (7) spatially offset in relation to the incoming light beam (1), and capable of modifying this spatial offset, focusing means (9) for focusing the outgoing light beam (7), a substrate holder (59), a movement device (60) for generating a movement (41) between the outgoing light beam (7) and the substrate (11); —providing and placing the substrate (11) on the substrate holder (59); —etching the substrate with the focused outgoing light beam (7) having an angle of attack (107) greater than 1° for any spatial offset between outgoing light beam (7) and incoming light beam (1) imposed by the optical system (2).Type: GrantFiled: June 26, 2018Date of Patent: March 8, 2022Assignee: LASER ENGINEERING APPLICATIONSInventors: Paul-Etienne Martin, Anne Henrottin, Sébastien Estival, Axel Stefan M. Kupisiewicz, Jose Ramos De Campos
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Publication number: 20210260691Abstract: A method for providing a first and a second laser beam, which are spatially offset in relation to an input laser beam. The method includes: providing a laser source for generating the input laser beam; providing a spatial offsetting unit for providing an offset laser beam that can keep the same polarization between the input laser beam and the offset laser beam; providing a separating unit including a first module for separation by polarization in order to obtain, from the offset laser beam: the first laser beam spatially offset by transmission; and the second laser beam spatially offset by reflection, the first and second spatially offset laser beams being suitable for each describing a circle.Type: ApplicationFiled: July 24, 2019Publication date: August 26, 2021Applicant: LASER ENGINEERING APPLICATIONSInventors: Paul-Etienne Martin, Sébastien Estival, Axel Kupisiewicz, Jose-Antonio Ramos De Campos
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Publication number: 20210205922Abstract: A laser machining device includes a generator and a director to generate and to direct, respectively, a gas stream to an area lying above a machining support in such a way as to create a suction effect that entrains machining dust away from said machining support.Type: ApplicationFiled: June 7, 2019Publication date: July 8, 2021Applicant: LASER ENGINEERING APPLICATIONSInventors: Jose Antonio Ramos De Campos, Audrey Champion, Laurent Lirot, David Bruneel, Axel Kupisiewicz
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Publication number: 20210170698Abstract: A system for holding a workpiece in position and exposing it to laser radiation, such that: the workpiece includes a bottom surface and a top surface that are electrically insulated from each other. The system includes an electrostatic charge generating device for generating electrostatic charges on the top surface; an electrically conductive support for forming, on the bottom surface, electrostatic charges of opposite sign to those generated on the top surface; and a laser device for machining or welding. The electrostatic charge generating device is arranged to be activated before or during the laser machining or welding, such that the workpiece is held in position relative to the electrically conductive support during the machining or welding thereof.Type: ApplicationFiled: July 16, 2019Publication date: June 10, 2021Applicant: LASER ENGINEERING APPLICATIONSInventors: Marc Décultot, Anne Henrottin, Jérôme Patars, Jose-Antonio Ramos De Campos, Axel Kupisiewicz
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Publication number: 20210114137Abstract: An optical device for detecting the drift of a light beam of a laser machining system includes a beam splitter for obtaining a first light beam along a first optical path and a second light beam along a second optical path. The optical device further includes a focal module positioned at least partially along the first optical path to obtain a focused light beam that is directed towards a first light beam matrix detection means positioned in a focusing plane associated with the focal module. The optical device also includes an afocal module positioned at least partially along the second optical path to obtain a collimated light beam that is directed towards a second light beam matrix detection means.Type: ApplicationFiled: March 25, 2019Publication date: April 22, 2021Applicant: LASER ENGINEERING APPLICATIONSInventors: Sébastien Estival, Paul-Etienne Martin
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Publication number: 20210034798Abstract: A method for simulating laser machining of a material by a laser machining system comprising the following steps: providing a central unit with: information relating to the material to be machined: delta ?, threshold fluence, incubation coefficient S, complex refractive index n+ik, information about the laser processing system: information relating to a polarization, pulse energy EP, diameter of said machining laser beam at a focal point w, order of a Gaussian p, pulse repetition rate PRR n, wavelength; determining with said central unit on the basis of the information relating to said material to be machined and the laser machining system, a machining profile in two dimensions corresponding to the simulation of a machining of said material to be machined with said laser machining system.Type: ApplicationFiled: January 25, 2019Publication date: February 4, 2021Applicant: LASER ENGINEERING APPLICATIONSInventors: David BRUNEEL, Liliana CANGUEIRO, Paul-Etienne MARTIN, José-Antonio RAMOS DE CAMPOS, Axel KUPISIEWICZ
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Publication number: 20210031304Abstract: Method for determining laser machining parameters for the machining of a material using a laser machining system comprises the following steps: a) providing said central unit with a learning machining function capable of learning on the basis of said plurality of machining data samples, said learning machining function comprising an algorithm capable of defining the following laser machining parameters for said machining result sought and for said machining system: a polarization, an pulse energy Ep, a diameter at the focal point w, a Gaussian order p, a pulse repetition rate PRR of pulses n, a wavelength; b) making said learning machining function to learn so as to said laser machining system can machine said material to be machined according to the machining result sought.Type: ApplicationFiled: January 25, 2019Publication date: February 4, 2021Applicant: LASER ENGINEERING APPLICATIONSInventors: David BRUNEEL, Liliana CANGUEIRO, Paul-Etienne MARTIN, José-Antonio RAMOS DE CAMPOS, Axel KUPISIEWICZ
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Publication number: 20210024411Abstract: Method for structuring a top surface of a transparent substrate, the substrate being transparent to visible light with a laser source able to emit a laser beam in a burst mode, the burst mode being characterized by a train of pulses comprising sets of laser pulses repeated over time; wherein each of the sets of laser pulses of the train of pulses comprises a first and second pulses with a time interval between them comprised between 5 ns to 50 ns, preferably between 10 ns to 40 ns, and more preferably about 25 ns; wherein each of the first and second pulses has an energy density on the top surface comprised between 0.5 nJ/um2 and 50 nJ/um2; and wherein the train of pulses is able to structure the top surface.Type: ApplicationFiled: July 26, 2019Publication date: January 28, 2021Applicant: LASER ENGINEERING APPLICATIONSInventors: Christopher Reed, Robert Braunschweig
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Publication number: 20200130099Abstract: Method for structuring a substrate (11) and comprising the following steps: —providing a device (100) comprising a light source (33), an optical system (2) for obtaining an outgoing light beam (7) spatially offset in relation to the incoming light beam (1), and capable of modifying this spatial offset, focusing means (9) for focusing the outgoing light beam (7), a substrate holder (59), a movement device (60) for generating a movement (41) between the outgoing light beam (7) and the substrate (11); —providing and placing the substrate (11) on the substrate holder (59); —etching the substrate with the focused outgoing light beam (7) having an angle of attack (107) greater than 1° for any spatial offset between outgoing light beam (7) and incoming light beam (1) imposed by the optical system (2).Type: ApplicationFiled: June 26, 2018Publication date: April 30, 2020Applicant: LASER ENGINEERING APPLICATIONSInventors: Paul-Etienne Martin, Anne Henrottin, Sébastien Estival, Axel Stefan M. Kupisiewicz, Jose Ramos De Campos
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Publication number: 20190168340Abstract: A method of assembling a substrate with a part is provided. The method includes a step of structuring the substrate by a pulsed laser. In one example, the substrate is metallic and the part is polymer-based. The structuring step engraves grooves into the substrate in a pattern determined by the relative motion of the beam and the substrate. The pattern is configured to provide improved adhesion between the structured substrate and a part after assembling the substrate and the part by laser welding. The method of assembling may further include a pre-treatment step of the structured surface to allow improve laser absorption during the welding assembling.Type: ApplicationFiled: April 26, 2017Publication date: June 6, 2019Applicants: Laser Engineering Applications, Fundacion Andaltec I+D+iInventors: Anne HENROTTIN, Jose Antonio RAMOS DE CAMPOS, Axel KUPISIEWICZ, Gabriel MORALES CID, Rafael GONZÁLEZ HIGUERASC, Francisco Javier NAVAS MARTOS
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Patent number: 10279426Abstract: Machining device (100) comprising: a light source (33); an optical system (2) for obtaining a spatially offset outgoing light beam (7) remaining parallel to a given position upstream focusing means (9), said optical system (2) comprising: a movable mirror (19) such that its normal is able to depict a trajectory in a three-dimensional space, said optical system (2) being configured such that said first incident light beam (4) and said normal to the movable mirror (19) are separated by an angle (15) comprised between 0° and 15° for all possible positions and orientations of said movable mirror (19); driving means (6) for moving said movable mirror (19); a retro reflection system (21) able to provide a second incident light beam (8) parallel to a first reflected light beam (23) on said movable mirror (19); focusing means (9) for focusing outgoing light beam (7) on a target (10).Type: GrantFiled: August 12, 2016Date of Patent: May 7, 2019Assignee: LASER ENGINEERING APPLICATIONSInventors: Sébastien Estival, Paul-Etienne Martin, Axel Kupisiewicz