Abstract: The disclosure relates to a method of fabricating a test socket that supports a probe stretchable in a longitudinal direction. The method of fabricating a test socket includes forming a coupling block by joining an insulating member of an insulating material to one surface of a base member of a conductive material, forming a probe accommodating hole for accommodating the probe in the coupling block and a first support hole for supporting one end portion of the probe, forming a second support hole in a cover member of an insulating material for supporting the other end portion of the probe, inserting the probe into the probe accommodating hole so that the one end portion of the probe is supported by the first support hole, and joining the cover member to the other surface of the base member so that the other end portion of the probe is supported by the second support hole.

Abstract: Disclosed is a test socket. The test socket includes a base frame shaped like a plate having a plurality of probe holes and conductive probes accommodated in the plurality of probe holes, having terminal portions protruding from both sides of the base frame, and comprising elastic material having higher elastic deformation than the base frame and conductive particles distributed in the elastic material.

Abstract: Disclosed is a test device for testing an electric characteristic of an object to be tested. The test device includes a block comprising a probe hole, a probe supported in the probe hole and retractably configured to connect a first contact point and a second contact point, and a coaxial cable comprising an insulated sheath, a main core surrounded with the insulated sheath, and a probe contact portion exposed from the insulated sheath and extended from the main core so as to be in contact with the probe. An axis of the probe is spaced apart from an axis of the coaxial cable, and the probe contact portion is extended from the main core toward the axis of the probe.

Abstract: Disclosed is a test device for testing a high-frequency and high-speed semiconductor. The test device includes a probe supporting block formed with a tube accommodating portion along a test direction; a conductive shield tube accommodated in the tube accommodating portion; and a probe accommodated and supported in the shield tube without contact, the tube accommodating portion including a conductive contact portion for transmitting a ground signal to the shield tube. When a high-frequency and high-speed semiconductor or the like subject is tested, the test device easily and inexpensively prevents crosstalk between the adjacent signal probes and improves impedance characteristic.

Abstract: The disclosure relates to a method of fabricating a test socket that supports a probe stretchable in a longitudinal direction. The method of fabricating a test socket includes forming a probe hole for accommodating the probe in a base member made of a conductive material, filling the probe hole with a resin as an insulating material to a predetermined depth from an upper surface of the base member to form a probe support member; and forming a first support hole for supporting one end portion of the probe in the probe support member in the probe hole to expose the one end portion of the probe.

Abstract: The disclosure relates to a method of fabricating a test socket including forming a plate-shaped first coupling block by joining a first base member made of a conductive material and a first insulating member made of an insulating material; forming a plate-shaped second coupling block by joining a second base member made of the conductive material and a second insulating member made of the insulating material; forming a first barrel accommodating hole for accommodating a part of the probe and a first support hole for supporting one end portion of the probe in the first coupling block; forming a second barrel accommodating hole for accommodating the rest of the probe and a first support hole for supporting the other end portion of the probe in the second coupling block; inserting one end of the probe into the first barrel accommodating hole to be supported on the first support hole, and inserting the other end of the probe into the second barrel accommodating hole to be supported on the second support hole; an

Abstract: Disclosed is a test socket supporting a probe. The test socket includes a socket block of an insulating material, provided with a probe hole to accommodate the probe, and a coating portion comprising an external film of a conductive material coated on an outer surface of the socket block, and an internal film of a conductive material coated on an inner surface of the probe hole, at least a portion of the internal film being electrically isolated from the external film.

Abstract: Disclosed is a test device for testing an electric characteristic of an object to be tested. The test device includes a block comprising a probe hole, a probe supported in the probe hole and retractably configured to connect a first contact point and a second contact point, and a coaxial cable comprising an insulated sheath, a main core surrounded with the insulated sheath, and a probe contact portion exposed from the insulated sheath and extended from the main core so as to be in contact with the probe. An axis of the probe is spaced apart from an axis of the coaxial cable, and the probe contact portion is extended from the main core toward the axis of the probe.

Abstract: Disclosed is a test device for testing a high-frequency and high-speed semiconductor. The test device includes a probe supporting block formed with a tube accommodating portion along a test direction; a conductive shield tube accommodated in the tube accommodating portion; and a probe accommodated and supported in the shield tube without contact, the tube accommodating portion including a conductive contact portion for transmitting a ground signal to the shield tube. When a high-frequency and high-speed semiconductor or the like subject is tested, the test device easily and inexpensively prevents crosstalk between the adjacent signal probes and improves impedance characteristic.

Abstract: A test probe for testing electric characteristics of an object to be tested. The test probe includes: a first contact portion; a second contact portion movable close to or away from the first contact portion; and an elastic deformation portion connecting the first contact portion and the second contact portion and elastically deformed by compression in a probe axial line direction, wherein at least one of the first contact portion and the second contact portion comprises a plurality of split contact portions separated by a first slit formed along a lengthwise direction. According to the present disclosure, the plurality of split contact portions are configured to independently contact the tested contact point of the object to be tested, thereby not only enhancing contact reliability but also securing contact reliability by an alternative split contact portion even though one of the split contact portions is defective or damaged.

Abstract: A test device for testing electric characteristics of an object to be tested. The test device includes: a first support member comprising a plurality of guide holes; a second support member comprising a plurality of terminal holes and arranged to be spaced apart from and in parallel with the first support member; a plurality of main contact probes; and a plurality of sub contact probes arranged to be adjacent to the main contact probes along a lengthwise direction. According to the present disclosure, contact reliability is improved by multi contact with the terminal of the test circuit board (interposer) and/or the object to be tested.

Abstract: Disclosed is a test socket for inspecting an electronic device that is particular about properties. The test socket for inspecting electric properties of a subject includes a plurality of probes configured to be retractable in an inspection direction; a probe supporter configured to support the plurality of probes so that first ends of the plurality of probes protrudes to contact with an object contact point of a subject; and a printed circuit board (PCB) configured to be placed beneath the probe supporter, be mounted with electronic parts, be formed with holes through which second ends of the plurality of probes pass, include at least one first pad with which at least one second end of the plurality of probes comes into contact and at least one second pad formed on an opposite side to the first pad, and be formed with electric paths extended from the first pad and the second pad and connected to the mounted electronic parts.

Abstract: A test device for testing electric properties of an object. The test device includes an object support unit configured to support an object; a cover unit configured to include a cover body coupled to the object support unit and a pusher supported by the cover body so as to move toward and away from the object; and a pressure adjuster configured to include a multi-stage adjusting cam which is rotatably provided in the cover body while contacting the pusher and has a multi-stage contact pressing portion with contact radii varied depending on rotated angles so that the pusher can be in a moving-back position and be positioned at a plurality of pressing distances from the cover body, and an operation unit which operates the multi-stage adjusting cam.

Abstract: Disclosed is a coaxial probe comprising, an internal conductor comprising an upper contact configured to contact a semiconductor device; a lower contact configured to contact a tester for testing the semiconductor device; and an internal elastic member configured to elastically bias at least one of the upper and lower contacts to make the upper and lower contacts distant from each other; an external conductor configured to surround the internal conductor; a plurality of gap members which is respectively inserted into opposite ends between the internal conductor and the external conductor to create a predetermined air gap between the internal conductor and the external conductor; and at least one external elastic member that is inserted into an external circumferential surface of the external conductor to elastically bias at least one of the semiconductor device and the tester to a direction that makes either the semiconductor device or the test distant from the external conductor.

Abstract: Disclosed is an inspection apparatus for a semiconductor device, which is to inspect an electric characteristic of an inspective object having a plurality of electric inspective contact points. The inspection apparatus includes a socket assembly which includes a plurality of probe pins retractable in a longitudinal direction, a probe pin supporter supporting the probe pins in parallel with each other, and a socket board including a plurality of fixed contact points a first end portion of the probe pins, and an inspective object carrier which includes an inspective object accommodating portion accommodating the inspective object so that the inspective contact points face toward a second end portion of the probe pins, and a floor member interposed between the inspective object and the probe pin supporter and including probe holes penetrated corresponding to the inspective contact points and passing the second end portion of the probe pin therethrough.

Abstract: Disclosed is a probe which stably transmits a test signal. The probe electrically connects a semiconductor device and a tester for testing the semiconductor device. The probe may include an upper plunger which is configured to be electrically connected to the semiconductor device; a lower plunger which is configured to be electrically connected to the tester; an elastic member which is disposed between the upper plunger and the lower plunger, and elastically biases the upper and lower plungers to have them spaced from each other; a conductive member which is disposed in an inside or outside of the elastic member and electrically connects the upper plunger and the lower plunger; and a barrel which accommodates therein the upper plunger, the lower plunger, the elastic member and the conductive member.

Abstract: Disclosed is a probe which stably transmits a test signal. The probe electrically connects a semiconductor device and a tester for testing the semiconductor device. The probe may include an upper plunger which is configured to be electrically connected to the semiconductor device; a lower plunger which is configured to be electrically connected to the tester; an elastic member which is disposed between the upper plunger and the lower plunger, and elastically biases the upper and lower plungers to have them spaced from each other; a conductive member which is disposed in an inside or outside of the elastic member and electrically connects the upper plunger and the lower plunger; and a barrel which accommodates therein the upper plunger, the lower plunger, the elastic member and the conductive member.

Abstract: The present invention relates to a probe device for testing a semiconductor chip, and has the aim of providing a probe device for testing with higher test reliability through an improved structure that enables test current to flow safely, the probe device including a barrel open at the top and bottom thereof and a probe projection formed on a top end to contact a connection terminal of a semiconductor chip, an upper plunger having a lower portion housed in an upper portion of the barrel, and a lower plunger having an upper portion housed in a lower portion of the barrel, wherein a metal ball contained in cylindrical silicon to form a conductive silicon portion that exhibits conductivity and housed inside the band electrically connects the upper plunger and the lower plunger and resiliently supports the downward pressure transferred to the upper plunger during the testing of a semiconductor chip, such that the conductive silicon portion containing the metal ball for exhibiting conductivity and inserted in the

Abstract: A socket for testing a semiconductor chip includes a base cover, a conductive sheet, upper plungers, a housing, lower plungers and a support plate. The base cover has a coupling opening in the central portion thereof, and the conductive sheet is fitted into the coupling opening of the base cover and includes conductive parts and an insulation part. The upper plungers are seated onto upper ends of the conductive parts and come into contact with corresponding terminals of the semiconductor chip. The housing has insert holes at positions corresponding to the upper plungers and fastens the upper plungers to the corresponding conductive parts. The lower plungers are provided under lower ends of the conductive parts and come into contact with corresponding terminals of a PCB to electrically connect the conductive parts to the PCB.

Abstract: A contact probe and a socket for testing semiconductor chips are provided with a simple structure, so that they can be easily manufactured, and can reduce a signal path not only to improve test reliability but also remarkably reduce the dimensions of test equipment. The contact probe comprises: a nonconductive elastic plate having main through-holes corresponding to contact terminals of a test target; plungers coupled on upper sides of the main through-holes, each having a plunger head that is elastically supported by the elastic plate and a plunger body that extends downwards from the center of the plunger head; and contact pins coupled on lower sides of the main through-holes, each having a receiving hole contacting the plunger body of each plunger at a center thereof.