Abstract: The present invention relates to low dielectric materials essential for a semiconductor having high density and high performance of the next generation, particularly to a process for preparing a porous interlayer insulating film having low dielectric constant containing pores with a size of a few nanometers or less.
Type:
Application
Filed:
May 28, 2003
Publication date:
November 20, 2003
Applicant:
LG Chem Investment, Ltd., a Korea corporation