Abstract: This invention relates to a composition for repairing metallic articles which in its initial state is in the form of an adhesive, self-supporting putty, capable of being molded including 5-15% by weight of a sacrificial binder containing at least one acrylic resin and volatile solvent. The invention also relates to a kit for the composition and methods for repair.

Abstract: A method of depositing metal onto an edge of a metallic substrate, preferably a metallic, thin-edge substrate, involves: (1) directing a high intensity light beam onto the substrate, thereby melting a portion of the substrate and forming a weld pool; (2) while directing the light beam onto the weld pool, introducing a filler wire into the weld pool, wherein exposure to the light beam and residual heat in the weld pool causes the filler wire to melt into the weld pool, the light beam providing sufficient energy to fuse the molten filler wire to the substrate; (3) feeding the filler wire into the weld pool while effecting relative motion between the filler wire and the light source relative to the substrate such that a continuous weld bead is formed from the weld pool; and (4) during steps (1)-(3), exposing the weld pool and filler wire disposed therein to a shielding gas so as to protect the weld pool and filler wire from oxidation.

Abstract: This invention relates to a composition for repairing metallic articles which in its initial state is in the form of an adhesive, self-supporting putty, capable of being molded including 5-15% by weight of a sacrificial binder containing at least one acrylic resin and volatile solvent. The invention also relates to a kit for the composition and methods for repair.

Abstract: To repair or join sections of a metal article, matching metal powder is sintered in the solid state to form a porous structure in the joint. A layer of matching powder, modified to incorporate melting point depressants such as boron and silicon is subsequently added to the surface of the sintered region. The joint is processed at a temperature where the modified layer melts while the sintered layer and base metal remain solid. The modified material flows into the sintered layer by capillary action and promotes liquid phase sintering, resulting in a dense joint with properties approaching those of the base metal.

Abstract: The present invention is designed to improve a method of deposition of coatings upon a metal or alloy substrate. The coating comprises aluminum or aluminide material interdiffused with a transition metal deposited by chemical vapor deposition which utilizes organometallic precursors to facilitate the deposition of the transition metal. The improvement permits better control of the process and permits coating of complex substrates including those with internal passages or holes. In the embodiment involving a first deposition of aluminum or aluminide coating, applicants have achieved deposition thereon of the transition metal. Platinum is the preferred transition metal to be used in the subject method. A product is taught. This product can be a component from a gas turbine engine.

Abstract: A process for the chemical vapor deposition on substrates of coatings comprising compounds of a titanium sub-group of metals, the vanadium sub-group of metals and the chromium sub-group of metals at temperatures in the range of 250.degree. C. is disclosed. Sub-halides, such as TiCl.sub.3, are reacted with N.sub.2 and H.sub.2 and thermodynamic and kinetic parameters are manipulated by flow rates and partial pressures of the reactants to achieve the deposition reaction in the temperature range of 250.degree. C. to 850.degree. C. The invention also relates to a metal compound coated article. An apparatus for performing the process is also disclosed.

Abstract: An apparatus for the chemical vapor deposition on substrates of coatings comprising compounds of a titanium sub-group of metals, the vanadium sub-group of metals and the chromium sub-group of metals at temperatures in the range of 250.degree. to 850.degree. C. is disclosed. Sub-halides, such as TiCl.sub.3, are reacted with N.sub.2 and H.sub.2 and thermodynamic and kinetic parameters are manipulated by flow rates and partial pressures of the reactants to achieve the deposition reaction in the temperature range of 250.degree. to 850.degree. C.