Patents Assigned to LIGITEK ELECTRONICS CO., LTD.
  • Patent number: 12008202
    Abstract: A touch light-emitting module and a manufacturing method thereof are disclosed. The touch light-emitting module includes a printed circuit board and a touch-control conductor. The printed circuit board has a top surface on which a touch-control IC and a luminous unit that is electrically connected are disposed. The touch-control conductor includes a hollowed portion. The touch-control conductor is coated, on the bottom thereof, with a conductive material to combine with the top surface of the printed circuit board, so that the touch-control IC and the luminous unit are located in the hollowed portion. An encapsulation resin is then injected into a space between the printed circuit board and the hollowed portion to complete encapsulation. As such, the present invention offers a simplified structure to achieve an effect of minimization, and also simplifies the manufacturing process and reduces the working time to thereby enhance the yield.
    Type: Grant
    Filed: May 11, 2023
    Date of Patent: June 11, 2024
    Assignee: LIGITEK ELECTRONICS CO., LTD.
    Inventors: Yi-Wen Chen, Wen-Chung Chou, I-Hsin Tung
  • Patent number: 10890837
    Abstract: A structured light projection system including a substrate, a semiconductor laser chip, a first optical module, and a second optical module is provided. The semiconductor laser chip is electrically connected to the substrate. The first optical module is disposed on the substrate. The second optical module is disposed on the first optical module. The deviation rate between optical axes of the optical modules and the semiconductor laser chip and the calibration time thereof are reduced by the first optical module directly packaging the substrate through a primary optics design, so as to increase the yield of the structured light projection.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: January 12, 2021
    Assignee: LIGITEK ELECTRONICS CO., LTD.
    Inventors: Hsiao-Wen Lee, I-Hsin Tung
  • Patent number: 10750070
    Abstract: A light-emitting diode (LED) includes s a substrate, a LED chip, and an optical lens. The LED chip is fixedly mounted to the substrate for emitting a light beam. The optical lens is mounted to the substrate and covers the LED chip. The optical lens has a light exit surface, which directs the light beam from the LED chip to travel in a direction along an optical axis to form a non-symmetric light shape. Also disclosed is a surveillance camera device that uses the LED. As such, the drawback of a conventional surveillance camera being incapable of acquiring an excellent image due to light source being overly concentrated can be eliminated.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: August 18, 2020
    Assignee: Ligitek Electronics Co., Ltd.
    Inventors: Hsiao-Wen Lee, I-Hsin Tung
  • Publication number: 20190317390
    Abstract: A structured light projection system including a substrate, a semiconductor laser chip, a first optical module, and a second optical module is provided. The semiconductor laser chip is electrically connected to the substrate. The first optical module is disposed on the substrate. The second optical module is disposed on the first optical module. The deviation rate between optical axes of the optical modules and the semiconductor laser chip and the calibration time thereof are reduced by the first optical module directly packaging the substrate through a primary optics design, so as to increase the yield of the structured light projection.
    Type: Application
    Filed: April 16, 2019
    Publication date: October 17, 2019
    Applicant: LIGITEK ELECTRONICS CO., LTD.
    Inventors: Hsiao-Wen Lee, I-Hsin Tung
  • Publication number: 20130235583
    Abstract: The instant disclosure relates to a lighting module, which includes at least a pair of light fixtures. Each of the light fixtures has a frame, a light source assembly, and a cover. The frame has a base plate, a first side plate, and a second side plate. The first side plate has a first engaging portion, and the second side plate has a second engaging portion and a plurality of third engaging portions. The two light fixtures are interlocked to one another by the following means: the first engaging portion and the first side plate of one light fixture are engaged to the second engaging portion and the third engaging portions of the other light fixture, respectively.
    Type: Application
    Filed: March 9, 2012
    Publication date: September 12, 2013
    Applicant: LIGITEK ELECTRONICS CO., LTD.
    Inventors: CHIEN-LI CHANG, I-HSIN TUNG
  • Publication number: 20130068832
    Abstract: This prevention provides a method for wirelessly controlling an electronic device with a quick response code. The method is performed in a calculating device with internet capability. The method comprises receiving a graphics information of the quick response code of the electronic device, decoding the quick response code, downloading a controlling and driving program of the corresponding electronic device for installation according to the decoded quick response code, configuring an internet protocol of the electronic device by the controlling and driving program, and controlling the electronic device by the controlling and driving program through the internet protocol wirelessly. Accordingly, the calculating device with internet capability can control the electronic device with a quick response code, such that the calculating device with internet capability can improve living facilities of the user.
    Type: Application
    Filed: September 21, 2011
    Publication date: March 21, 2013
    Applicant: LIGITEK ELECTRONICS CO., LTD.
    Inventors: YI-CHI LI, TSUNG-TAO WU
  • Publication number: 20120281387
    Abstract: A structure of light-emitting diode includes a base, a circuit board, at least one light emission chip, a light-transmitting resin layer, and a light adjustment film. The base forms a cavity. The circuit board is mounted at a bottom of the cavity. The light emission chip is electrically connected to the circuit board. The light-transmitting resin layer is received in the cavity and bonded to the circuit board to encapsulate the light emission chip. The light adjustment film is separately provided and is set on a top of the light-transmitting resin layer and contains therein uniformly distributed powders of phosphor to allow the light-emitting diode to project uniform light.
    Type: Application
    Filed: May 4, 2011
    Publication date: November 8, 2012
    Applicant: LIGITEK ELECTRONICS CO., LTD.
    Inventors: I-Hsin Tung, Chiy-Ferng Perng, Mei-Jung Chien
  • Publication number: 20120081891
    Abstract: A structure of light tube includes a main body, a power supply module, and at least one light emission element. The main body has first and second heat dissipation zones and an accommodation chamber. The main body has two ends respectively and electrically connected to two conductive terminals. The power supply module is received and retained in the accommodation chamber of the main body. The power supply module includes an enclosure forming a receiving space in which a power supply device is received and retained. The light emission element is coupled to the main body so that heat from the light emission element is directly drained through the main body, while the power supply dissipates heat through natural air flows without relying on the main body, so that there parts do not cause thermal interference with each other and the performance of heat dissipation is improved to thereby extend the lifespan of the light tube.
    Type: Application
    Filed: September 30, 2010
    Publication date: April 5, 2012
    Applicant: LIGITEK ELECTRONICS CO., LTD.
    Inventors: I-Hsin Tung, Chiy-Ferng Perng, Chia-Hao Hsieh, Che-Min Chien, Che-Wei Chang