Patents Assigned to LIQUIDCOOL SOLUTIONS, INC.
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Patent number: 11452241Abstract: A server system formed by a first group of liquid submersion cooled servers, which are part of one or more server module assemblies mounted on the rack. A first power shelf is mounted on the rack and is electrically connected to the first group of liquid submersion cooled servers to provide electrical power to the first group. In addition, a second group of liquid submersion cooled servers, which are part of one or more server module assemblies is also mounted on the rack below the first group. A second power shelf is mounted on the rack below the first group and below the first power shelf, and the second power shelf is electrically connected to the second group of liquid submersion cooled servers to provide electrical power to the second group.Type: GrantFiled: November 17, 2020Date of Patent: September 20, 2022Assignee: LiquidCool Solutions, Inc.Inventors: Lyle Rick Tufty, Steve Shafer, Rafael Alba, Gary Allen Reed
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Patent number: 11122704Abstract: Liquid submersion cooling devices and systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool individual electronic devices or an array of electronic devices. In one embodiment, the electronic device includes a non-pressurized device housing defining an interior space where pressure in the interior space equals or is only slightly different than pressure outside the non-pressurized device housing.Type: GrantFiled: November 15, 2019Date of Patent: September 14, 2021Assignee: LiquidCool Solutions, Inc.Inventors: Sean Michael Archer, Steve Shafer, David Roe, Lyle Rick Tufty
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Patent number: 11032939Abstract: An enclosure for an electronic system that is configured to act as a heat exchanger to remove heat from a cooling liquid that is circulated through the electronic system for cooling the electronic components thereof which are submerged in the cooling liquid in direct contact therewith. The enclosure uses an arrangement of a combination of external fins on one or more walls and fluid passages formed in one or more of the walls through which the cooling liquid is circulated for cooling. The fluid passages and the external fins are preferably formed on the same wall. The fins and the fluid passages can be formed on any number of walls of the enclosure.Type: GrantFiled: December 17, 2018Date of Patent: June 8, 2021Assignee: LiquidCool Solutions, Inc.Inventors: Rick Tufty, Steve Shafer
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Patent number: 10609839Abstract: Liquid submersion cooling devices and systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool individual electronic devices or an array of electronic devices. In one embodiment, the electronic device includes a non-pressurized device housing defining an interior space where pressure in the interior space equals or is only slightly different than pressure outside the non-pressurized device housing.Type: GrantFiled: September 28, 2018Date of Patent: March 31, 2020Assignee: LIQUIDCOOL SOLUTIONS, INC.Inventors: Sean Michael Archer, Steve Shafer, David Roe, Lyle Rick Tufty
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Patent number: 10390458Abstract: Liquid submersion cooling systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool an array of electronic devices. In some embodiments described herein, rather than using pump pressure to return the cooling liquid back to a cooling liquid reservoir, gravity can be used to return the cooling liquid to a reservoir via a cooling liquid gravity return manifold, and a pump can only be used on the liquid supply side to deliver the cooling liquid to each electronic device.Type: GrantFiled: September 20, 2018Date of Patent: August 20, 2019Assignee: LIQUIDCOOL SOLUTIONS, INC.Inventors: Lyle Rick Tufty, Gary Allan Reed, Sean Michael Archer, Rafael Alba
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Patent number: 10271456Abstract: An enclosure for an electronic system that is configured to act as a heat exchanger to remove heat from a cooling liquid that is circulated through the electronic system for cooling the electronic components thereof which are submerged in the cooling liquid in direct contact therewith. The enclosure uses an arrangement of a combination of external fins on one or more walls and fluid passages formed in one or more of the walls through which the cooling liquid is circulated for cooling. The fluid passages and the external fins are preferably formed on the same wall. The fins and the fluid passages can be formed on any number of walls of the enclosure.Type: GrantFiled: September 28, 2015Date of Patent: April 23, 2019Assignee: LIQUIDCOOL SOLUTIONS, INC.Inventors: Rick Tufty, Steve Shafer
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Patent number: 9918408Abstract: A fluid delivery system configuration is described for use with an array of liquid submersion cooled electronic devices disposed in a rack, such as an array of liquid submerged servers. The fluid delivery system allows for the pumping system to generate pressure and flow of the cooling system fluid at slightly higher levels than is necessary for the worst case device/position within the array and to provide for uniformity of delivery pressure and coolant flow to each and every device within the array.Type: GrantFiled: August 18, 2016Date of Patent: March 13, 2018Assignee: LIQUIDCOOL SOLUTIONS, INC.Inventors: Laurent Regimbal, Sean Archer, Steve Shafer, Lyle R. Tufty
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Patent number: 9913402Abstract: A scalable liquid submersion cooling system for electronics. The system includes a plurality of modular system components, such as electronics enclosures, manifolds, pumps, and heat exchanger units. The modular system components permit the liquid submersion cooling system to be scaled up or down to accommodate changing needs. In addition, the modularity of the components facilitates portability, allowing relatively easy transport and set-up/break-down of electronic systems.Type: GrantFiled: July 13, 2016Date of Patent: March 6, 2018Assignee: LIQUIDCOOL SOLUTIONS, INC.Inventors: Steve Shafer, Sean Archer, David Roe, Lyle R. Tufty
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Patent number: 9451726Abstract: A fluid delivery system configuration is described for use with an array of liquid submersion cooled electronic devices disposed in a rack, such as an array of liquid submerged servers. The fluid delivery system allows for the pumping system to generate pressure and flow of the cooling system fluid at slightly higher levels than is necessary for the worst case device/position within the array and to provide for uniformity of delivery pressure and coolant flow to each and every device within the array.Type: GrantFiled: September 25, 2013Date of Patent: September 20, 2016Assignee: LiquidCool Solutions, Inc.Inventors: Laurent Regimbal, Sean Archer, Steve Shafer, Lyle R. Tufty
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Patent number: 9426927Abstract: A scalable liquid submersion cooling system for electronics. The system includes a plurality of modular system components, such as electronics enclosures, manifolds, pumps, and heat exchanger units. The modular system components permit the liquid submersion cooling system to be scaled up or down to accommodate changing needs. In addition, the modularity of the components facilitates portability, allowing relatively easy transport and set-up/break-down of electronic systems.Type: GrantFiled: November 21, 2014Date of Patent: August 23, 2016Assignee: LIQUIDCOOL SOLUTIONS, INC.Inventors: Steve Shafer, Sean Archer, David Alan Roe, Lyle R. Tufty
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Patent number: 9223360Abstract: A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.Type: GrantFiled: November 29, 2012Date of Patent: December 29, 2015Assignee: LIQUIDCOOL SOLUTIONS, INC.Inventor: Chad D. Attlesey
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Patent number: 9176547Abstract: A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.Type: GrantFiled: November 29, 2012Date of Patent: November 3, 2015Assignee: LIQUIDCOOL SOLUTIONS, INC.Inventor: Chad D. Attlesey
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Patent number: 9128681Abstract: A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.Type: GrantFiled: November 29, 2012Date of Patent: September 8, 2015Assignee: LIQUIDCOOL SOLUTIONS, INC.Inventor: Chad D. Attlesey
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Patent number: 9086859Abstract: A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.Type: GrantFiled: November 29, 2012Date of Patent: July 21, 2015Assignee: LIQUIDCOOL SOLUTIONS, INC.Inventor: Chad D. Attlesey
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Patent number: 9051502Abstract: A fluid composition or nanofluid is described that includes a dielectric base fluid, a chemical dispersant, and nanoparticles dispersed in the dielectric fluid. The chemical dispersant is used to facilitate the nanoparticle dispersing process and also to increase the stability of the nanofluid thus produced. The nanofluid is compatible with electronics and has enhanced thermal conductivity for use in cooling electronics. Techniques are described that can be used to efficiently disperse different forms of nanoparticles into a base fluid and produce a stable nanofluid which is compatible with electronic circuitry and components.Type: GrantFiled: January 24, 2012Date of Patent: June 9, 2015Assignee: LIQUIDCOOL SOLUTIONS, INC.Inventors: Salah S. Sedarous, Chad D. Attlesey
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Publication number: 20140085821Abstract: A fluid delivery system configuration is described for use with an array of liquid submersion cooled electronic devices disposed in a rack, such as an array of liquid submerged servers. The fluid delivery system allows for the pumping system to generate pressure and flow of the cooling system fluid at slightly higher levels than is necessary for the worst case device/position within the array and to provide for uniformity of delivery pressure and coolant flow to each and every device within the array.Type: ApplicationFiled: September 25, 2013Publication date: March 27, 2014Applicant: LiquidCool Solutions, Inc.Inventors: Laurent Regimbal, Sean Archer, Steve Shafer, Lyle R. Tufty
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Patent number: 8654529Abstract: A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.Type: GrantFiled: November 29, 2012Date of Patent: February 18, 2014Assignee: LiquidCool Solutions, Inc.Inventor: Chad D. Attlesey
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Patent number: 8467189Abstract: A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.Type: GrantFiled: December 6, 2011Date of Patent: June 18, 2013Assignee: LiquidCool Solutions, Inc.Inventor: Chad Daniel Attlesey
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Publication number: 20130094146Abstract: A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.Type: ApplicationFiled: November 29, 2012Publication date: April 18, 2013Applicant: LIQUIDCOOL SOLUTIONS, INC.Inventor: LIQUIDCOOL SOLUTIONS, INC.
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Publication number: 20130081791Abstract: A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.Type: ApplicationFiled: November 29, 2012Publication date: April 4, 2013Applicant: LIQUIDCOOL SOLUTIONS, INC.Inventor: Liquidcool Solutions, Inc.