Patents Assigned to LMDJ MANAGEMENT LLC
  • Semiconductor structure having silver-indium transient liquid phase bonding joint
    Patent number: 11894284
    Abstract: A semiconductor structure having a silver-indium transient liquid phase bonding joint is provided. With the ultra-thin silver-indium transient liquid phase bonding joint formed between the semiconductor device and the heat-spreading mount, its thermal resistance can be minimized to achieve a high thermal conductivity. Therefore, the heat spreading capability of the heat-spreading mount can be fully realized, leading to an optimal performance of the high power electronics and photonics devices.
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: February 6, 2024
    Assignee: LMDJ MANAGEMENT LLC
    Inventors: Yongjun Huo, Chin Chung Lee