Abstract: Heat transfer device (30) dissipates and removes heat energy from a heat source and delivers the heat energy to a heat sink. Heat transfer device (30) includes diamond substrate (32) for receiving the heat energy from the heat source. Interconnect point (36) connects to diamond substrate (32). Fiber (34), such as a carbon fiber, connects at interconnect point (36) to receive the heat energy from diamond substrate (32) and conduct the heat energy to the heat sink.
Type:
Grant
Filed:
February 5, 1997
Date of Patent:
October 20, 1998
Assignee:
Lockhead Fort Worth Company
Inventors:
Judson V. Arnold, James R. Peoples, Elbert L. McKague