Abstract: A string light engine includes a plurality of LEDs, a plurality of IDC connectors, and an insulated flexible conductor. Each IDC connector is in electrical communication with at least one of the plurality of LEDs and is operatively mechanically connected to at least one of the plurality of LEDs. The IDC connectors attach to the conductor.

Abstract: Phosphor compositions having the formula EueMmAaGgQqNnXx, where M is at least one of Be, Mg, Ca, Sr, Ba, Cd, Sn, Pb or Zn; A is at least one of B, Al, Ga, In, Bi, Sc, Y, La or a rare earth element other than Eu; G is at least one of Si or Ge; Q is at least one of O, S, and Se; X is at least one of F, Cl, Br and I; 0<e<2, 0<m<2, 0?a<1, 0<g<1, 0<q<4, 0?n<2, 0?x<2, and 2e+2m+3a+4g=2q+3n+x; and light emitting devices including a light source and the above phosphor. Also disclosed are blends of EueMmAaGgQqNnXx and one or more additional phosphors and light emitting devices incorporating the same.

Abstract: Light emitting devices including a light source and a phosphor material including a complex fluoride phosphor activated with Mn4+ which may comprise at least one of (1) A2[MF6]:Mn4+, where A is selected from Li, Na, K, Rb, Cs, NH4, and combinations thereof; and where M is selected from Ge, Si, Sn, Ti, Zr, and combinations thereof; (2) E[MF6]:Mn4+, where E is selected from Mg, Ca, Sr, Ba, Zn, and combinations thereof; and where M is selected from Ge, Si, Sn, Ti, Zr, and combinations thereof; (3) Ba0.65Zr0.35F2.70:Mn4+; or (4) A3[ZrF7]:Mn4+ where A is selected from Li, Na, K, Rb, Cs, NH4, and combinations thereof.

Abstract: A booster optic is provided in an LED light assembly that includes a primary reflective surface to redirect light towards a desired location to form an illuminance pattern that when combined with a first illuminance pattern, which is formed by only the primary reflector, provides a combined illuminance pattern having a more uniform illuminance characteristic as compared to not having the booster optic.

Abstract: A LED signal includes a housing and a cover. At least one LED is arranged on a PCB and mounted within the housing. A collimator that collimates light energy emitted by the at least one LED is positioned adjacent to the at least one LED. A diffuser is positioned adjacent to the collimator and spreads collimated light transmitted through the collimator. The PCB, the collimator, and the diffuser are disposed between the cover and the housing, and the cover provides a protective barrier between environmental conditions and the collimator and diffuser.

Abstract: A luminaire includes a fixture housing, a plurality of LEDs disposed on a mounting surface in the fixture housing, and at least one reflector disposed in the housing. A center of each LED is positioned along a line and each LED faces towards an associated target surface that is vertically spaced from the luminaire. The at least one reflector includes first and second reflective surfaces. Each reflective surface is configured with respect to the line on which the LEDs are positioned so that the first reflective surface and the second reflective surface each reflect light from each of the LEDs in a substantially same direction that is offset from a vertical axis.

Abstract: A linear LED light module and system includes a heat sink, a printed circuit board, a plurality of LEDs, a power supply housing, a flexible electrical conductor, a first electrical connector, a second electrical connector, and a power supply. The heat sink is elongated in an axial direction along a longitudinal axis that is parallel with a greatest dimension of the heat sink. The PCB is in thermal communication with the heat sink and includes circuitry. The plurality of LEDs mount to the PCB and are in electrical communication with the circuitry of the PCB. The power supply housing connects to the heat sink. The flexible electrical conductor includes at least two wires that are configured to accommodate an AC line voltage of at least 120 VAC. The first electrical connector is at a first end of the electrical conductor. The second electrical connector is at a second end of the electrical conductor.

Abstract: An LED device including an LED chip and a lens positioned apart from the chip and coated with a uniform thickness layer of fluorescent phosphor for converting at least some of the radiation emitted by the chip into visible light. Positioning the phosphor layer away from the LED improves the efficiency of the device and produces more consistent color rendition. The surface area of the lens is preferably at least ten times the surface area of the LED chip. For increased efficiency, the reflector and submount can also be coated with phosphor to further reduce internal absorption.

Abstract: In a method for fabricating a flip-chip light emitting diode device, epitaxial layers (14, 114) are deposited on a growth substrate (16, 116) to produce an epitaxial wafer. A plurality of light emitting diode devices are fabricated on the epitaxial wafer. The epitaxial wafer is diced to generate a device die (10, 110). The device die (10, 110) is flip chip bonded to a mount (12, 112). The flip chip bonding includes securing the device die (10, 110) to the mount (12, 112) by bonding at least one electrode (20, 22, 120) of the device die (10, 110) to at least one bonding pad (26, 28, 126) of the mount (12, 112). Subsequent to the flip chip bonding, a thickness of the growth substrate (16, 116) of the device die (10, 110) is reduced.

Abstract: A lighting apparatus for emitting white light including a semiconductor light source emitting radiation with a peak at from about 250 nm to about 500 nm; a first phosphor having a peak emission between about 450 and 550 nm; and a second phosphor having a peak emission between about 615 and 670 nm; wherein the overall emission spectrum of the lighting apparatus has a depression between about 550 and 615 nm, said depression extending to between about 5% and 25% of the highest intensity of the emission spectrum of the lighting apparatus in the region from 400 to 700 nm. In this apparatus, the red-green color contrast is increased versus the referent illuminant.

Abstract: Phosphor compositions having the formula LlMmAaGgPpQqNnZz:Ce3+, where L is at least one of Li, Na, K, Rb, and/or Cs; M is at least one of Be, Mg, Ca, Sr, Ba, Mn, Sn, Pb, and/or Zn; A is at least one of Bi, Sb, In, Sc, Y, and/or any of the rare earth elements; G is Si and/or Ge; Q is at least one of O, S, and/or Se; Z is at least one of F, Cl, Br, and/or I; and wherein 0?l?1, 2.5?m?5, 1.5?a?2.5, 2?g?2.5, 0?p?1, 0?n?1, 0?z?1, and l+2m+3a+4g+5p=2q+3n+z; and light emitting devices including a light source and the above phosphor. Also disclosed are blends of LlMmAaGgPpQqNnZz:Ce3+ and one or more additional phosphors and light emitting devices incorporating the same.

Abstract: Disclosed are oxynitride phosphor compositions having the formula (RE1-xCex)3Ala-y-z-wSiyGazScwO12-yNy, where RE is at least one of Lu, Gd, Y, and Tb, 0.001?x?0.10, 0?w?2, 0.001?y?0.50, 0?z?4.999, and 4.5?a?5.0. When combined with radiation from a blue or UV LED, these phosphors can provide light sources with good color quality having high CRI over a large color temperature range. Also disclosed are blends of the above oxynitride phosphors and additional phosphors.

Abstract: A light emitting apparatus (8) includes one or more light emitting chips (10) that are disposed on a printed circuit board (12) and emit light predominantly in a wavelength range between about 400 nanometers and about 470 nanometers. The printed circuit board includes: (i) an electrically insulating board (14); (ii) electrically conductive printed circuitry (20); and (iii) an electrically insulating solder mask (22) having vias (24) through which the one or more light emitting chips electrically contact the printed circuitry. The solder mask (22) has a reflectance of greater than 60% at least between about 400 nanometers and about 470 nanometers.

Abstract: An LED light engine includes a flexible electrical cable, a wire-socket assembly attached to the cable, and an LED module selectively attached to the wire-socket assembly. The wire-socket assembly includes at least two IDC terminals. The IDC terminal displaces the insulating covering of the cable and contacts one of the electrical conductors. The LED module includes an LED electrically connected to the IDC terminals when the LED module attaches to the wire-socket assembly.

Abstract: The inventive signal incorporates an intelligent diagnosis module inside a light emitting diode (LED) signal, such as an LED traffic signal. The inventive signal can self-extinguish or send a signal through its communication port at the end of its useful life when the LEDs are no longer providing the required light output. Additionally, the inventive signal sends a signal to increase the current as the LEDs degrade to ensure the light output is above a threshold minimum.

Abstract: A connector electrically connects corresponding conductors of at least first and second cables. The connector comprises a connecting portion into which the conductors of the first and second cables are inserted opposing one another to electrically connect corresponding conductors of each cable. A positive terminal and a negative terminal terminate and electrically connect corresponding conductors of each cable.