Abstract: Provided is a wireless Bluetooth earphone, which belongs to the field of headphone technology. The wireless Bluetooth earphone comprises a housing, a circuit board, a battery, a connection ring, and a connection terminal. The housing comprises a main housing and a battery housing. The circuit board is arranged in the main housing. The connection ring has a first end and a second end. The first end is connected to one end of the main housing, that is, the first end is connected to one end of the rear housing arranged with an opening. The second end is detachably connected to the battery housing, and the battery is arranged in the battery housing. The connection terminal is arranged in the connection ring. One end of the connection terminal is electrically connected to the circuit board, and the other end of the connection terminal is electrically connected to the battery.

Abstract: A headset for audio play, comprising one or more sensor circuit and a control module. The control module comprises a secondary processor circuit and a primary processor circuit. The sensor circuit generates sensor data according to structural deformations of the headset. The secondary processor circuit receives the sensor data and calculates measured values related to the structural deformations of the headset. The primary processor circuit coupled to the secondary processor circuit controls an audio play operation in the headset, and enters a sleep mode when the audio play operation is not required. The secondary processor circuit determines a usage status of the headset according to the measured value and one or more threshold value. The secondary processor circuit wakes the primary processor circuit according to the usage status, and adaptively adjusts at least one threshold value according to the usage status.

Abstract: A hinge assembly comprises a first connecting member, a second connecting member, a first shaft, a second shaft, and a clockwork spring. The first connecting member includes a first pivot portion. The second connecting member includes a second pivot portion. The first shaft is pivotally connected to the first pivotal portion of the first connecting member and the second pivotal portion of the second connecting member. The second shaft is configured on the first connecting member and spaced from the first shaft. The clockwork spring includes a first end and a second end away from the first end; the first end fixed to the second shaft rod, the second end fixed to the second connecting member. When the second connecting member pivots with respect to the first connecting member, the arrangement of the clockwork spring can provide a more stable pivoting force for the second connecting member.

Abstract: Provided are a semiconductor encapsulation structure and an encapsulation method. The structure includes a circuit board, which includes at least one electromagnetic shield area and a non-electromagnetic shield area located on one side of the electromagnetic shield area, where the circuit board internally includes a number N of metal line layers stacked in sequence and insulating layers located between adjacent metal line layers; a non-shield module and a shield module, where the non-shield module is located within the non-electromagnetic shield area, and the shield module is located within the electromagnetic shield area; a thin film encapsulation layer, located on a side of the circuit board adjacent to the first surface, where the thin film encapsulation layer covers the non-electromagnetic shield area and the electromagnetic shield area; an electromagnetic shield structure, which covers the electromagnetic shield area and forms the closed space with the circuit board.

Abstract: A manufacturing method includes performing imposition on at least two discrete double-side packaged structures such that lateral electrical connection structures located on the same side of each of the at least two discrete double-side packaged structures are coplanar; and electrically mounting a first component onto lateral electrical connection structures on the first side, where a double-side packaged structure includes a substrate, the lateral electrical connection structures are formed on the first face and the second face of the substrate, and the first face is opposite to the second face and is adjacent to the first side.

Abstract: The present disclosure relates to a charging box, comprising a box body, a box cover, a battery, a charging assembly and a circuit assembly. The box body is internally provided with a product cabin for accommodating a product; the box cover is arranged at an opening of the box body; the battery is arranged in the box body; the charging assembly comprises a magnet pendulum bob and a coil structure arranged around it, wherein a first end of the magnet pendulum bob is rotatably connected with the box body and a second end is a free end; and the circuit assembly is electrically connected with the coil structure and the battery. Therefore, by arranging the charging box in a special shape, the coil structure may cut a magnetic field of the magnet pendulum bob to generate induced current to charge the charging box so as to increase endurance.

Abstract: A sonic ranging method for a mobile phone and a wireless earphone. Firstly, the mobile phone performs an acoustic response test on the wireless earphone. The mobile phone generates a first audio sequence at a first time slot. The wireless earphone recognizes the first audio sequence to generate a second audio sequence. When the mobile phone recognizes the second audio sequence, the mobile phone estimates a length of elapsed time according to the time difference between a current time slot and the first time slot. When the mobile phone obtains the length of elapsed time, a distance between the wireless earphone and the mobile phone may be determined according to a delay compensation parameter and the length of elapsed time. Various potential applications can be implemented based on the invention without the needs for additional hardware circuits in the mobile phone.

Abstract: A manufacturing method of a double-sided package structure includes securing at least two discrete double-sided mount structures to a first side of a master at intervals; molding the first side of the master to form a molded body encasing the at least two discrete double-sided mount structures; removing the master; and splitting the molded body to obtain individual double-sided package structures.

Abstract: The invention provides a package structure, comprising: a substrate disposed with a solid grounded copper layer; at least two radio frequency chip modules disposed on the substrate; a plastic encapsulation disposed on the substrate, covered on a surface of the substrate, and coating the at least two radio frequency chip modules therein; a groove located between the adjacent two radio frequency chip modules, and penetrating an upper surface and a lower surface of the plastic encapsulation; a solder filling body filled in the groove, wherein an upper surface of the solder filling body is flushed with the upper surface of the plastic encapsulation; and a shielding layer covered on the upper surface and lateral surfaces of the plastic encapsulation, an upper surface of the solder filling body and lateral surfaces of the substrate; wherein a position of the solid grounded copper layer corresponds to a position of the groove, and makes contact with the solder filling body in the groove.

Abstract: A connecting cable includes a first end, a second end and a heat dissipation channel in communication with the first end and the second end. The first end is adapted to connect with a first component. The second end is adapted to connect with a second component. The present disclosure also discloses a cable connector, a charger, and a charger assembly having the connecting cable. Compared with the prior art, in the present disclosure, by providing the heat dissipation channel in the connecting cable, the heat generated by the electronic device can be discharged in time through the heat dissipation channel. Therefore, the heat dissipation performance is improved.

Abstract: Provided are a semiconductor encapsulation structure and an encapsulation method. The structure includes a circuit board, which includes at least one electromagnetic shield area and a non-electromagnetic shield area located on one side of the electromagnetic shield area, where the circuit board internally includes a number N of metal line layers stacked in sequence and insulating layers located between adjacent metal line layers; a non-shield module and a shield module, where the non-shield module is located within the non-electromagnetic shield area, and the shield module is located within the electromagnetic shield area; a thin film encapsulation layer, located on a side of the circuit board adjacent to the first surface, where the thin film encapsulation layer covers the non-electromagnetic shield area and the electromagnetic shield area; an electromagnetic shield structure, which covers the electromagnetic shield area and forms the closed space with the circuit board.

Abstract: The invention provides a package structure, comprising: a substrate disposed with a solid grounded copper layer; at least two radio frequency chip modules disposed on the substrate; a plastic encapsulation disposed on the substrate, covered on a surface of the substrate, and coating the at least two radio frequency chip modules therein; a groove located between the adjacent two radio frequency chip modules, and penetrating an upper surface and a lower surface of the plastic encapsulation; a solder filling body filled in the groove, wherein an upper surface of the solder filling body is flushed with the upper surface of the plastic encapsulation; and a shielding layer covered on the upper surface and lateral surfaces of the plastic encapsulation, an upper surface of the solder filling body and lateral surfaces of the substrate; wherein a position of the solid grounded copper layer corresponds to a position of the groove, and makes contact with the solder filling body in the groove.

Abstract: A connection structure and a wearing device are provided. The connecting structure includes a connecting member, a latching member, an engaging member, and an elastic member; one of two ends of the latching member is rotatably connected with the connecting member, and the other end of the latching member is provided with a latching portion; the engaging member is provided with an engaging portion corresponding to the latching portion, and the elastic member can engage the latching portion with the engaging portion. The wearing device includes the connection structure. The latching member is rotatably connected with the connecting member so as to enable the latching member to be quickly separated from the engaging member, and two mechanisms could be connected and separated from each other quickly with the connection structure.

Abstract: A connection structure and a wearing device are provided. The connecting structure includes a connecting member, a latching member, an engaging member, and an elastic member; one of two ends of the latching member is rotatably connected with the connecting member, and the other end of the latching member is provided with a latching portion; the engaging member is provided with an engaging portion corresponding to the latching portion, and the elastic member can engage the latching portion with the engaging portion. The wearing device includes the connection structure. The latching member is rotatably connected with the connecting member so as to enable the latching member to be quickly separated from the engaging member, and two mechanisms could be connected and separated from each other quickly with the connection structure.