Patents Assigned to Manufacturing Integration Technology Ltd
  • Patent number: 10403782
    Abstract: A method for laser scribing of thin-films for the manufacture of solar cell panels comprises loading a workpiece with the transparent substrate facing downwards in an input station of a first machine; biasing a reference edge of the workpiece against a front and rear stopper associated with a linear drive; translating the workpiece back and forth between the input station and output station and firing two or more laser beams at a first frequency substantially vertically through a space between the input and output stations to pass through the transparent substrate of the workpiece to scribe parallel lines on the front electrodes with reference to the edge of the workpiece in contact with the front and rear stoppers; and indexing the two or more laser sources and repeating the back and forth translation of the work piece between the input and output stations.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: September 3, 2019
    Assignee: Manufacturing Integration Technology Ltd
    Inventors: Kim Mone Kwong, Teck Keong Boh, Kok Yeow Lim, Han Yong Lam
  • Patent number: 9929036
    Abstract: A system and method for peeling a semiconductor chip from a tape using a multistage ejector is disclosed. A housing in the multistage ejector houses a plural sets of tape removing contacts. A pick and place unit is moved slowly to have contact with the chip. A vacuum source is utilized for generating vacuum to suck the tape. Plural sets of contacts such as inner, middle and outer contacts are independently or together moved below the tape at various stages by utilizing their respective actuation mechanism. A controller can independently control the movements of each contact to effectively remove or loosen the tape from the chip. A pick and place unit can then pick up the chip easily without any damage to chip.
    Type: Grant
    Filed: May 13, 2015
    Date of Patent: March 27, 2018
    Assignee: MANUFACTURING INTEGRATION TECHNOLOGY LTD
    Inventors: Kim Mone Kwong, Kok Yeow Lim, Zhiqiang Mao
  • Patent number: 8864121
    Abstract: The present invention describes an adaptive clamp width adjusting device (200) for use in an integrated circuit package process machine. The device (200) includes a travel component (210) and a fixed component (310). The travel component (210) carries a clamp (220a,220b) with an adjustable width and a rotary screw (230a) operable for such adjustment by a driven wheel (232). The fixed component (310), mounted on a base plate (312), includes a motor (320) and a drive wheel (324) attached to the motor shaft. When the device (200) is in a clamp width conversion station (40a), the travel component (210) is aligned above the fixed component (310) so that when the base plate (312) is raised and the drive wheel (324) engages the driven wheel (232), the clamp width is operable to be adjusted by the motor (320) according to a width of a workpiece (W).
    Type: Grant
    Filed: June 18, 2009
    Date of Patent: October 21, 2014
    Assignee: Manufacturing Integration Technology Ltd
    Inventors: Xiang Bao Zhang, Siew Hua Ng, Teck Keong Boh, Kim Mone Kwong
  • Patent number: 8727693
    Abstract: The present invention provides apparatuses for processing an object just as semiconductor chips and dies. The first embodiment comprises two or more pick and place heads (FIG. 1) which operate sequentially (ie leap frog) to pick components from a first location to a second. The second embodiment (FIG. 8) comprises a flipping head combined with a pick and place heads where an object is picked up by the flipping head, turned over and then presented to a pick and place head for relocation to an output.
    Type: Grant
    Filed: May 6, 2008
    Date of Patent: May 20, 2014
    Assignee: Manufacturing Integration Technology Ltd
    Inventors: Francis Medel P. Tundag, Han Yong Lam, Kam Yee Fong
  • Publication number: 20120181259
    Abstract: The present invention describes an apparatus (100) for a first laser scribing (P1) on the front electrode of a thin film solar cell panel and a similar apparatus (100a) for subsequent laser scribing (P2, P3) on the semiconductor layer and semiconductor layer/rear electrode. Before starting scribing process P1, the left hand edge or reference line on the left hand edge on a workpiece is aligned substantively parallel to the linear drive (140) before translating the workpiece on the apparatus (100). Similarly, the first and second scribed lines (Lp1, Lp2) formed during the P1 and P2 processes are separately aligned parallel to the linear drive (140) before starting the relevant process (P2, P3). Alternatively, parallelism of the workpiece is carried out for each batch of the workpiece. In both apparatuses (100, 100a), the laser sources (150) are mounted on independently motorized axes.
    Type: Application
    Filed: October 7, 2009
    Publication date: July 19, 2012
    Applicant: Manufacturing Integration Technology Ltd.
    Inventors: Kim Mone Kwong, Teck Keong Boh, Kok Yeow Lim, Han Yong Lam
  • Publication number: 20110095467
    Abstract: The present invention describes an adaptive clamp width adjusting device (200) for use in an integrated circuit package process machine. The device (200) includes a travel component (210) and a fixed component (310). The travel component (210) carries a clamp (220a,220b) with an adjustable width and a rotary screw (230a) operable for such adjustment by a driven wheel (232). The fixed component (310), mounted on a base plate (312), includes a motor (320) and a drive wheel (324) attacked to the motor shaft. When the device (200) is in a clamp width conversion station (40a), the travel component (210) is aligned above the fixed component (310) so that when the base plate (312) is raised and the drive wheel (324) engages the driven wheel (232), the clamp width is operable to be adjusted by the motor (320) according to a width of a workpiece (W).
    Type: Application
    Filed: June 18, 2009
    Publication date: April 28, 2011
    Applicant: Manufacturing Integration Technology Ltd,
    Inventors: Xiang Bao Zhang, Siew Hua Ng, Teck Keong Boh, Kim Mone Kwong
  • Patent number: 7363102
    Abstract: The present invention provides a precise marking apparatus for performing precise marking on an object and methods of using the same. The precise marking apparatus comprises an object input handler and an object output handler for handling the object; a transport system for transporting the object handlers during a marking process; a vision inspection unit for capturing and/or processing the image of the object; a marking system for marking the object; and a control unit for receiving information from and sending instructions to other components of the precise marking apparatus. The present invention also provides a precise placement apparatus for precise marking and/or precise packaging an object and methods of using the same. The present invention further provides a precise marking and placement apparatus for performing precise marking on an object and precise placement of the object for final packaging and methods of using the same.
    Type: Grant
    Filed: March 9, 2005
    Date of Patent: April 22, 2008
    Assignee: Manufacturing Integration Technology Ltd
    Inventors: Slew Heng Yong, Piau Yew Foo
  • Patent number: 7155299
    Abstract: The present invention provides a precise marking apparatus for performing precise marking on an object and methods of using the same. The precise marking apparatus comprises an object input handler and an object output handler for handling the object; a transport system for transporting the object handlers during a marking process; a vision inspection unit for capturing and/or processing the image of the object; a marking system for marking the object; and a control unit for receiving information from and sending instructions to other components of the precise marking apparatus.
    Type: Grant
    Filed: June 1, 2004
    Date of Patent: December 26, 2006
    Assignee: Manufacturing Integration Technology Ltd
    Inventors: Siew Heng Yong, Piau Yew Foo