Abstract: A connecting pad of a magnetic head element is bonded to a signal conductor of a supporting beam. As a result of the bonding, the magnetic head element is mechanically coupled to the supporting beam and the connecting pad is electrically connected to the signal conductor. Also an auxiliary pad of the magnetic head element is bonded to the signal conductor. This bonding improves the mechanical coupling strength of the magnetic head element to the supporting beam. When the magnetic head element is to be bonded to the supporting beam, one of the pads is bonded to the signal conductor, and thereafter the other pad is bonded to the signal conductor. During the process of the latter bonding, a groove which is previously disposed in the signal conductor blocks heat given for the bonding from being transmitted to the former bonding portion in which bonding has been already completed, thereby preventing the bonding of the former bonding portion from being broken.

Abstract: A method of bonding a contact-type thin film magnetic head element to a beam for supporting the head element in a contact-type thin film magnetic head during a process of producing the magnetic head is disclosed. A connecting pad of the magnetic head element is made contact with a signal conductor of the supporting beam. Then, a vibration energy of an ultrasonic wave is applied to the contact portion so that the surfaces of the components in the contact portion are caused to diffuse into each other. As a result, a state in which the connecting pad is mechanically coupled and electrically connected to the signal conductor is obtained.