Abstract: A monochromatic chip-scale packaging (CSP) light emitting diode (LED) device with an asymmetrical radiation pattern, including a flip-chip LED semiconductor die, and a reflective structure, is disclosed. A white-light broad-spectrum CSP LED device with asymmetrical radiation pattern is also disclosed by further including a photoluminescent structure in the CSP LED device. The photoluminescent structure covers at least the upper surface of the LED semiconductor die. The reflective structure adjacent to the LED semiconductor die and the photoluminescent structure reflects at least partial light beam emitted from the edge surface of the LED semiconductor die or the edge surface of the photoluminescent structure, therefore shaping the radiation pattern asymmetrically. A method to fabricate the aforementioned CSP LED device is also disclosed.

Abstract: A method for mass arrangement of micro-component devices includes the following process stages: disposing the micro-component devices to float on a liquid suspending medium, wherein the micro-component devices are spaced apart from each other with a larger initial gap along a first direction and along a second direction; using electromagnetic force to actuate the floating micro-component devices to move closer so that the micro-component devices become spaced apart from each other with a smaller specified target gap along the first and the second directions; and transferring the arranged micro-component devices with the target gap on a carrier substrate. A system for arranging the micro-component devices is also disclosed to implement the method. Therefore, a precisely arranged array of the micro-component devices can be formed on a target application substrate.

Abstract: A light-emitting device includes a flip-chip LED semiconductor chip to provide a primary light, a photoluminescent (PL) structure disposed on the LED semiconductor chip and a moisture-barrier reflective structure covering a chip-edge surface of the LED semiconductor chip and a photoluminescent-side surface of the PL structure. The sequentially stacked PL structure includes a first PL layer, a transparent isolation layer, a second PL layer and a transparent moisture barrier layer. For example, the LED semiconductor chip emits a blue light, the first PL layer includes a red phosphor material, and the second PL layer includes a green quantum dot (QD) material. Therefore, the red phosphor material of the first PL layer can convert a portion of the higher-energy-level blue light into a lower-energy-level converted red light, so as to reduce an intensity of an unconverted portion of the blue light reaching the green QD material within the second PL layer.

Abstract: A chip scale packaging (CSP) light-emitting device including a light-emitting semiconductor die and a layer-by-layer photoluminescent (PL) structure disposed on the light-emitting semiconductor die is disclosed. The PL structure includes a second PL layer and a first PL layer disposed over the second PL layer, wherein the first PL layer functions as a photoluminescent layer and a barrier layer protecting the second PL from ambient oxygen and moisture. The first PL layer includes a less-moisture-sensitive PL material dispersed within a first polymer matrix material, whereas the second PL layer includes a moisture-sensitive PL material dispersed within a second polymer material. With these arrangements, the outermost first PL layer comprising the less-moisture-sensitive photoluminescent material functions as a wavelength-conversion layer and also serves as a barrier layer protecting the inner second PL layer comprising the moisture-sensitive photoluminescent material from ambient oxygen and moisture.

Abstract: A monochromatic chip-scale packaging (CSP) light emitting diode (LED) device with an asymmetrical radiation pattern, including a flip-chip LED semiconductor die, and a reflective structure, is disclosed. A white-light broad-spectrum CSP LED device with asymmetrical radiation pattern is also disclosed by further including a photoluminescent structure in the CSP LED device. The photoluminescent structure covers at least the upper surface of the LED semiconductor die. The reflective structure adjacent to the LED semiconductor die and the photoluminescent structure reflects at least partial light beam emitted from the edge surface of the LED semiconductor die or the edge surface of the photoluminescent structure, therefore shaping the radiation pattern asymmetrically. A method to fabricate the aforementioned CSP LED device is also disclosed.

Abstract: An asymmetrically shaped chip-scale packaging (CSP) light-emitting device (LED) includes an LED chip, a photoluminescent structure (or a light-transmitting structure), and a reflective structure. The photoluminescent structure covers the upper surface and/or the edge surface of the LED chip; and the reflective structure at least partially covers the edge surface of the photoluminescent structure. The reflective structure partially reflects the primary light emitted from the edge surface of the LED chip or the converted secondary light radiated from the edge surface of the photoluminescent structure, therefore shaping the radiation pattern asymmetrically.

Abstract: A chip-scale packaging (CSP) light-emitting device (LED), including a light-emitting semiconductor die, a photoluminescent layer, a chip-side-spacer structure, and a beveled chip reflective structure, is disclosed. The beveled reflective structure is disposed surrounding the chip-edge surfaces of the light-emitting semiconductor die, wherein the chip-side-spacer structure is disposed between the beveled reflective structure and the chip-edge surfaces of the light-emitting semiconductor die. A manufacturing method to fabricate the CSP LED is also disclosed. The CSP LED with a beveled chip reflector can effectively reflect the light radiated from the light-emitting semiconductor die toward the photoluminescent layer so that the light extraction efficiency is improved.

Abstract: A vacuum system for film lamination, including a vacuum chamber module, a film-pressing module, a substrate susceptor module and a hot-plate heating module, is disclosed, wherein the film-pressing module includes a film-pressing platen, and the substrate susceptor module includes a substrate susceptor supported by a spring-loaded mechanism. During a film-lamination process, the film-pressing platen is actuated to move downwards to attach a laminating film onto a substrate, and the substrate susceptor is actuated to move downwards and finally rest on the hot-plate heating module. Therefore an adhesive glue disposed between the laminating film and the substrate can be thermally cured. After completing the film-lamination process, the film-pressing platen is actuated upwards so that the substrate susceptor also is actuated to move upwards to its initial position by a restoring force exerted by the spring-loaded mechanism.

Abstract: A chip scale packaging (CSP) light-emitting device including a light-emitting semiconductor die and a layer-by-layer photoluminescent (PL) structure disposed on the light-emitting semiconductor die is disclosed. The PL structure includes a second PL layer and a first PL layer disposed over the second PL layer, wherein the first PL layer functions as a photoluminescent layer and a barrier layer protecting the second PL from ambient oxygen and moisture. The first PL layer includes a less-moisture-sensitive PL material dispersed within a first polymer matrix material, whereas the second PL layer includes a moisture-sensitive PL material dispersed within a second polymer material. With these arrangements, the outermost first PL layer comprising the less-moisture-sensitive photoluminescent material functions as a wavelength-conversion layer and also serves as a barrier layer protecting the inner second PL layer comprising the moisture-sensitive photoluminescent material from ambient oxygen and moisture.

Abstract: A photoluminescent display device includes a blue light source and a photoluminescent display panel adjoining the blue light source. The photoluminescent display panel includes a transparent substrate, a color filter structure and a photoluminescent structure. The color filter structure includes a red pixel region, a green pixel region and a blue pixel region arranged adjacent to one another on the transparent substrate. The photoluminescent structure, which is disposed on the color filter structure and is facing toward the blue light source, includes a red light-conversion layer and a green light-conversion layer, wherein the red light-conversion layer is disposed on the green light-conversion layer.

Abstract: A light emitting device, including an LED semiconductor die, a photoluminescent structure and a reflector, is disclosed. The photoluminescent structure with a beveled edge surface is disposed on top of the LED semiconductor die, wherein a lower surface of the photoluminescent structure adheres to an upper surface of the LED semiconductor die. A reflective resin material is disposed surrounding edge surfaces of the LED semiconductor die and the photoluminescent structure forming a beveled reflector. A method to manufacture the above light emitting device is also disclosed. Advantages of this light emitting device with beveled reflector include increasing the light extraction efficiency, making the viewing angle tunable, improving spatial color uniformity and reducing the light source etendue realized in a compact form-factor size.