Abstract: It is provided a steel with composite plating film providing rust prevention over a long time period and a method of manufacturing thereof. A composite plating film 24 is formed on a metal material 21. The film 24 has a plating film 23 made of a sacrificial anode metal and photocatalyst particles 22 dispersed and fixed in the plating film 23. The photocatalyst particle has a main body composed of a photocatalyst and a semiconductor material supported thereon. The composite plating film 24 is formed on the surface of the metal material 21 by electroplating, hot-dipping, chemical plating or the like.
Type:
Application
Filed:
January 27, 2014
Publication date:
July 17, 2014
Applicants:
KOYO ENGINEERING CO., LTD., MEISEI INDUSTRIAL COMPANY LIMITED
Abstract: It is provided a steel with composite plating film providing rust prevention over a long time period and a method of manufacturing thereof. A composite plating film 24 is formed on a metal material 21. The film 24 has a plating film 23 made of a sacrificial anode metal and photocatalyst particles 22 dispersed and fixed in the plating film 23. The photocatalyst particle has a main body composed of a photocatalyst and a semiconductor material supported thereon. The composite plating film 24 is formed on the surface of the metal material 21 by electroplating, hot-dipping, chemical plating or the like.
Type:
Grant
Filed:
November 14, 2006
Date of Patent:
March 18, 2014
Assignees:
Meisei Industrial Company Limited, Koyo Engineering Co., Ltd.
Abstract: It is provided a steel with composite plating film providing rust prevention over a long time period and a method of manufacturing thereof. A composite plating film 24 is formed on a metal material 21. The film 24 has a plating film 23 made of a sacrificial anode metal and photocatalyst particles 22 dispersed and fixed in the plating film 23. The photocatalyst particle has a main body composed of a photocatalyst and a semiconductor material supported thereon. The composite plating film 24 is formed on the surface of the metal material 21 by electroplating, hot-dipping, chemical plating or the like.
Type:
Application
Filed:
November 14, 2006
Publication date:
October 11, 2007
Applicants:
MEISEI INDUSTRIAL COMPANY LIMITED, KOYO ENGINEERING CO., LTD