Patents Assigned to MEISEI INDUSTRIAL COMPANY LIMITED
  • Publication number: 20140199539
    Abstract: It is provided a steel with composite plating film providing rust prevention over a long time period and a method of manufacturing thereof. A composite plating film 24 is formed on a metal material 21. The film 24 has a plating film 23 made of a sacrificial anode metal and photocatalyst particles 22 dispersed and fixed in the plating film 23. The photocatalyst particle has a main body composed of a photocatalyst and a semiconductor material supported thereon. The composite plating film 24 is formed on the surface of the metal material 21 by electroplating, hot-dipping, chemical plating or the like.
    Type: Application
    Filed: January 27, 2014
    Publication date: July 17, 2014
    Applicants: KOYO ENGINEERING CO., LTD., MEISEI INDUSTRIAL COMPANY LIMITED
    Inventors: Hirotaka YAMASHIRO, Yasuhisa MAEDA, Shuichi SAITOH, Katsuhisa KASHIWAZAKI
  • Patent number: 8673456
    Abstract: It is provided a steel with composite plating film providing rust prevention over a long time period and a method of manufacturing thereof. A composite plating film 24 is formed on a metal material 21. The film 24 has a plating film 23 made of a sacrificial anode metal and photocatalyst particles 22 dispersed and fixed in the plating film 23. The photocatalyst particle has a main body composed of a photocatalyst and a semiconductor material supported thereon. The composite plating film 24 is formed on the surface of the metal material 21 by electroplating, hot-dipping, chemical plating or the like.
    Type: Grant
    Filed: November 14, 2006
    Date of Patent: March 18, 2014
    Assignees: Meisei Industrial Company Limited, Koyo Engineering Co., Ltd.
    Inventors: Hirotaka Yamashiro, Yasuhisa Maeda, Shuichi Saitoh, Katsuhisa Kashiwazaki
  • Publication number: 20070237957
    Abstract: It is provided a steel with composite plating film providing rust prevention over a long time period and a method of manufacturing thereof. A composite plating film 24 is formed on a metal material 21. The film 24 has a plating film 23 made of a sacrificial anode metal and photocatalyst particles 22 dispersed and fixed in the plating film 23. The photocatalyst particle has a main body composed of a photocatalyst and a semiconductor material supported thereon. The composite plating film 24 is formed on the surface of the metal material 21 by electroplating, hot-dipping, chemical plating or the like.
    Type: Application
    Filed: November 14, 2006
    Publication date: October 11, 2007
    Applicants: MEISEI INDUSTRIAL COMPANY LIMITED, KOYO ENGINEERING CO., LTD
    Inventors: Hirotaka Yamashiro, Yasuhisa Maeda, Shuichi Saitoh, Katsuhisa Kashiwazaki