Abstract: An object is to provide an electroless copper plating solution with excellent solution stability and easy composition control while being used in a neutral range. To achieve the object, a reducing electroless copper plating solution used in a neutral range is employed that contains a copper salt serving as a copper ion supply source, a complexing agent for chelating copper ions, a reducing agent, a surfactant, an aromatic compound containing nitrogen, and contains a tellurium compound serving as a deposition stabilizer, and that has a solution pH of 6 to 9.

Abstract: An object of the present invention is to provide an electroless Ni—Fe alloy plating solution with which continuous plating can be carried out in a stable manner. An electroless Ni—Fe alloy plating solution comprising a nickel ion source, an iron ion source, a complexing agent and a reducing agent, wherein the iron ion source is a ferric ion source is provided. It is preferable that the ferric ion source is one or two or more iron salts selected from the group consisting of iron (III) sulfate, iron (III) chloride, iron alum, iron (III) oxide and iron (III) hydroxide. It is preferable that the content of the ferric ion is 0.001 to 1.0 mol/L at the time of the initial make-up of plating bath. It is preferable that the content of the ferrous ion is 0.1 mol/L or less at the time of the initial make-up of plating bath.

Abstract: A titanium stripping solution comprises an aqueous solution of pH 5 or lower containing a fluorine compound and a metal ion having a reducing power, which enables etching of titanium at a high etching rate by the fluorine compound with exhibiting an effect of suppressing corrosion of other metal(s).

Abstract: A SnO2 film having a prescribed pattern feature is formed on a substrate by a wet film-formation technology (e.g., sol-gel method). A Ni film is formed on the SnO2 film by an electroless plating method. The electroless plating method is conducted in the presence of at least one sulfur-containing compound selected from the group consisting of thiosulfates, thiocyanates and sulfur-containing organic compounds.

Abstract: A SnO2 film having a prescribed pattern feature is formed on a substrate by a wet film-formation technology (e.g., sol-gel method). A Ni film is formed on the SnO2 film by an electroless plating method. The electroless plating method is conducted in the presence of at least one sulfur-containing compound selected from the group consisting of thiosulfates, thiocyanates and sulfur-containing organic compounds.

Abstract: A SnO2 film having a prescribed pattern feature is formed on a substrate by a wet film-formation technology (e.g., sol-gel method). A Ni film is formed on the SnO2 film by an electroless plating method. The electroless plating method is conducted in the presence of at least one sulfur-containing compound selected from the group consisting of thiosulfates, thiocyanates and sulfur-containing organic compounds.

Abstract: There are provided a treatment solution for reducing a copper oxide formed on the surface of copper to copper, wherein dimethylamine borane is contained in an amount of 0.3 to 2.0 g/L and the relationship y≧0.232x−0.185 holds between the concentration y (g/L) of dimethylamine borane and an area x (dm2/L) to be treated per unit solution amount, and a treatment method for reducing a copper oxide formed on the surface of a copper material to copper by dipping the copper material in the treatment solution as described above, wherein the addition of dimethylamine borane to water is carried out within 10 minutes before the dipping of the copper material or after the dipping of the copper material.

Abstract: A method of circulating an electroless nickel plating solution is characterized in that the system comprises the following process steps effected in the following order: (A) a step of electrolessly plating nickel using a plating solution having nickel hypophosphite contained as a chief chemical material for supplying a plating metal ion Ni2+ and a hypophosphorous acid ion H2PO2− acting as a reducing agent; (B) a step of removing HPO32− from a plating solution that has aged in the step (A); (C) a step of desalting the mother liquor separated from the step (B); and (D) a step of adjusting the components of the treated plating solution and then circulating same back into the step (A) of electroless nickel plating. According to the present invention, the plating solution is free from the formation and accumulation of a sulfuric acid salt and hence a long service life is ensured and a great advantage in environmental protection is provided.