Patents Assigned to Micro-Circuits, Inc.
  • Adhesive component means for attaching electrical components to conductors
    Patent number: 4818823
    Abstract: A surface mounting method which utilizes an adhesive component to mount the electrical components to a printed circuit board instead of solder and which includes the use, between the contacting surfaces, of a flowable, corrosion-resistant material which bridges contact imperfections and penetrates surface films. The method may also be implemented to connect two electrical conductors.
    Type: Grant
    Filed: July 6, 1987
    Date of Patent: April 4, 1989
    Assignee: Micro-Circuits, Inc.
    Inventor: Robert F. Bradley