Patents Assigned to MICRODUINO INC.
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Patent number: 10585846Abstract: A multi-direction connectable electronic module includes a circuit board, including a top surface, a bottom surface, and at least one side; and a plurality of connectors connected to the circuit board, each including a lateral magnetic connector, a shell, a longitudinal inter-locking part, and a lateral inter-locking part. The lateral inter-locking part is configured to connect with a first electronic building block along the lateral direction. The longitudinal inter-locking part is configured to stack with a second electronic building block along the longitudinal direction. The lateral magnetic connector is configured to magnetically connect with the first electronic building block. A plurality of through holes are formed on the shell. A lateral pin connector disposed on the at least one side of the circuit board includes a plurality of pins located at positions corresponding to the plurality of through holes, and is configured to electrically connect the first electronic building block.Type: GrantFiled: June 28, 2018Date of Patent: March 10, 2020Assignees: MICRODUINO INC., MEIKE TECHNOLOGY (BEIJING) LTD.Inventors: Zhenshan Wang, Kejia Pan, Bin Feng, Xi Li
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Patent number: 9980405Abstract: The present disclosure provides an electrical module and a modular building system including electrical modules. The electrical module includes a housing member including N pin portions and a connecting portion that connects the N pin portions, where N is greater than 1; N conduction members unconnected with each other; and N magnetic members. Each pin portion is a plate having a through-hole towards its thickness direction, and corresponds to one conduction member and one magnetic member. Each conduction member includes: a first part electrically connected with a lead of an electrical component; and a second part electrically connected with the corresponding magnetic member. Each magnetic member fills the through-hole of the corresponding pin portion, and establishes magnetic connection with a magnetic member of another electrical module in thickness direction to allow the two electrical modules to contact and rotate against each other using a contacting point as a rotation pivot.Type: GrantFiled: March 10, 2016Date of Patent: May 22, 2018Assignees: Microduino Inc., Meike Technology (Beijing) Ltd.Inventors: Jian Hu, Kejia Pan, Zhenshan Wang, Xi Li, Bin Feng
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Patent number: 9801300Abstract: The present disclosure provides an electrical module and a modular electrical building system including electrical modules. The electrical module includes a printed circuit board (PCB), a housing member, one or more magnets, and one or more inter-locking parts. The PCB has a top surface, a bottom surface, and opposite sides between the top surface and the bottom surface. The housing member is attached to each side of two opposite sides of the PCB and includes an opening in a bottom surface. The magnets are arranged within the housing member and are capably of magnetically attaching the electrical module to another electrical module. Each inter-locking part is configured to pass through the housing member on each side of the PCB. Each inter-locking part has a protrusion extending from a top surface of the housing member and is exposed to the opening in the bottom surface of the housing member.Type: GrantFiled: May 26, 2015Date of Patent: October 24, 2017Assignees: MICRODUINO INC., MEIKE TECHNOLOGY (BEIJING) LTD.Inventors: Zhenshan Wang, Kejia Pan, Bin Feng
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Patent number: D807440Type: GrantFiled: October 14, 2016Date of Patent: January 9, 2018Assignees: MICRODUINO INC., MEIKE TECHNOLOGY (BEIJING) LTD.Inventors: Jian Hu, Kejia Pan, Zhenshan Wang, Xi Li, Taiming Suo, Bin Feng
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Patent number: D807968Type: GrantFiled: October 14, 2016Date of Patent: January 16, 2018Assignees: MICRODUINO INC., MEIKE TECHNOLOGY (BEIJING) LTD.Inventors: Jian Hu, Kejia Pan, Zhenshan Wang, Xi Li, Taiming Suo, Bin Feng
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Patent number: D807969Type: GrantFiled: October 14, 2016Date of Patent: January 16, 2018Assignees: MICRODUINO INC., MEIKE TECHNOLOGY (BEIJING) LTD.Inventors: Jian Hu, Kejia Pan, Zhenshan Wang, Xi Li, Taiming Suo, Bin Feng
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Patent number: D817412Type: GrantFiled: October 14, 2016Date of Patent: May 8, 2018Assignees: MICRODUINO INC., MEIKE TECHNOLOGY (BEIJING) LTD.Inventors: Jian Hu, Kejia Pan, Zhenshan Wang, Xi Li, Taiming Suo, Bin Feng
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Patent number: D838680Type: GrantFiled: August 19, 2015Date of Patent: January 22, 2019Assignees: MICRODUINO INC., MEIKE TECHNOLOGY (BEIJING) LTD.Inventors: Zhenshan Wang, Kejia Pan, Bin Feng
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Patent number: D851612Type: GrantFiled: June 30, 2017Date of Patent: June 18, 2019Assignees: MICRODUINO INC., MEIKE TECHNOLOGY (BEIJING) LTD.Inventors: Zhenshan Wang, Jian Hu, Kejia Pan, Xi Li, Bin Feng
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Patent number: D865689Type: GrantFiled: October 30, 2017Date of Patent: November 5, 2019Assignee: MICRODUINO INC.Inventors: Zhenshan Wang, Kejia Pan, Bin Feng
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Patent number: D866469Type: GrantFiled: April 8, 2016Date of Patent: November 12, 2019Assignees: MICRODUINO INC., MEIKE TECHNOLOGY (BEIJING) LTD.Inventors: Jian Hu, Kejia Pan, Zhenshan Wang, Xi Li, Bin Feng
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Patent number: D879729Type: GrantFiled: June 30, 2017Date of Patent: March 31, 2020Assignees: Microduino Inc., Meike Technology (Beijing) Ltd.Inventors: Zhenshan Wang, Jian Hu, Kejia Pan, Xi Li, Bin Feng