Abstract: The present invention relates to an apparatus and method for the design and manufacture of foldable integrated stiffeners. These stiffeners may be used in, for example, thin-film arrays of electrochemical devices.
Type:
Grant
Filed:
March 4, 2002
Date of Patent:
August 31, 2004
Assignee:
Microsat Systems, Inc.
Inventors:
Cary R. Clark, Jeff Summers, Jason Wood, Bill Zuckermandel