Abstract: A method for fabricating a hermetic electronic package includes providing a package body; hermetically coupling a package base plate to the package body; thermally coupling a substrate to the base plate; thermally mounting a semiconductor device to the substrate; bonding at least one high-current input/output (I/O) terminal to the first metalized region of the substrate by a strap terminal that is an integral high current heatsink terminal. A ceramic seal surrounding the at least one high-current I/O terminal is hermetically bonded to an outer surface of the package body. A metal hermetic seal washer surrounding the at least one high-current I/O terminal is hermetically bonded to the ceramic seal and to a portion of the at least one high-current I/O terminal. A lid is seam welded onto the package body.

Abstract: A method for fabricating a hermetic electronic package includes providing a package body; hermetically coupling a package base plate to the package body; thermally coupling a substrate to the base plate; thermally mounting a semiconductor device to the substrate; bonding at least one high-current input/output (I/O) terminal to the first metalized region of the substrate by a strap terminal that is an integral high current heatsink terminal. A ceramic seal surrounding the at least one high-current I/O terminal is hermetically bonded to an outer surface of the package body. A metal hermetic seal washer surrounding the at least one high-current I/O terminal is hermetically bonded to the ceramic seal and to a portion of the at least one high-current I/O terminal. A lid is seam welded onto the package body.

Abstract: An apparatus can include a first planar inductive sensor including two oscillator coils and two sensing coils. The apparatus can also include a second planar inductive sensor independent of the first sensor and also including a pair of oscillator and sensing coils. The apparatus can further include a high frequency alternating current carrier generator configured to inject high frequency alternating current carrier signals into the oscillator coils. The carrier signal for the oscillator coil of the first planar inductive sensor is 180 degrees out of phase with a 2nd oscillator coil of the same planar inductive sensor, and wound in an opposite geometric direction, and the oscillator coils of the other inductive sensor can also be wound similarly The two sensing coils of the first planar inductive sensor can be 90 degrees out of phase with each another, and the sensing coils of the other inductive sensor can also be wound similarly.

Abstract: A hermetic high-current electronic package includes a package body and a base plate hermetically coupled to the package body. A semiconductor device is thermally mounted to the base plate and has a high-current output. A high-current input/output (I/O) terminal is bonded to the high-current output of the semiconductor device by a strap terminal that is an integral high current heatsink terminal. The high-current I/O terminal passes through a hole formed in a sidewall of the package body. A ceramic seal surrounds the high-current I/O terminal and has a first surface hermetically bonded to an outer surface of the sidewall of the package body. A metal hermetic seal washer surrounds the high-current I/O terminal and is bonded to a second surface of the ceramic seal and bonded to a portion of the high-current I/O terminal that passes through the metal hermetic seal washer.

Abstract: An angular rotation sensor system constituted of: a first target with a member radially extending from, and rotating about a longitudinal axis of the first target; a second target with a member radially extending from, and rotating about a longitudinal axis of the second target; a first receive coil comprising a plurality of loops laid out such that adjacent loops exhibit opposing magnetic polarities responsive to a radio frequency current injected into the transmit coil; a second receive coil comprising a plurality of loops laid out such that adjacent loops exhibit opposing magnetic polarities responsive to a radio frequency current injected into the transmit coil; and an output coupled to each of the first and second receive coils, wherein each of the members is shaped and sized to generally match a shape and size of a pair of loops.

Abstract: An over-current protection apparatus constituted of: a transistor disposed on a substrate; a first thermal sense device arranged to sense a temperature reflective of a junction temperature of the transistor; a second thermal sense device arranged to sense a temperature reflective of a temperature of a casing surrounding the substrate; and a control circuitry, arranged to alternately: responsive to the sensed temperature by the first thermal sense device and the sensed temperature of the second thermal sense device being indicative that the temperature difference between the transistor junction and the substrate casing is greater than a predetermined value, switch off the transistor; and responsive to the sensed temperature by the first thermal sense device and the sensed temperature by the second thermal sense device being indicative that the temperature difference between the transistor junction and the substrate casing is not greater than the predetermined value, switch on the transistor.

Abstract: A power transistor assembly and method of mitigating short channel effects in a power transistor assembly are provided. The power transistor assembly includes a first layer of semiconductor material formed of a first conductivity type material and a hard mask layer covering at least a portion of the first layer and having a window therethrough exposing a surface of the first layer. The power transistor assembly also includes a first region formed in the first layer of semiconductor material of a second conductivity type material and aligned with the window, one or more source regions formed of first conductivity type material within the first region and separated by a portion of the first region, and an extension of the first region extending laterally through the surface of the first layer.

Abstract: Various electronics systems may benefit from appropriate limitation of short-to-ground current. For example, sensor systems may benefit from a voltage sensing mechanism to minimize short-to-ground current for low drop-out and bypass mode regulators. A system can include a first power transistor configured to operate in a low drop-out mode. The system can also include a short to ground sensor configured to control current to the first power transistor. The short to ground sensor can be configured to limit a maximum short-circuit current below a predefined load current capability.

Abstract: A planar linear inductive position sensor is formed on a substrate and includes at least one oscillating coil, a first sensing coil having opposing edges extending beyond opposing edges of the oscillating coil along a linear axis along which a linear position of a conductive target is to be sensed, and a second sensing coil having opposing edges extending beyond opposing edges of the oscillating coil along the linear axis.

Abstract: A planar linear inductive position sensor is formed on a substrate and includes at least one oscillating coil, a first sensing coil having opposing edges extending beyond opposing edges of the oscillating coil along a linear axis along which a linear position of a conductive object is to be sensed, and a second sensing coil having opposing edges extending beyond opposing edges of the oscillating coil along the linear axis.

Abstract: A hermetic high-current electronic package includes a package body and a base plate hermetically coupled to the package body. A semiconductor device is thermally mounted to the base plate and has a high-current output. A high-current input/output (I/O) terminal is bonded to the high-current output of the semiconductor device by a strap terminal that is an integral high current heatsink terminal. The high-current I/O terminal passes through a hole formed in a sidewall of the package body. A ceramic seal surrounds the high-current I/O terminal and has a first surface hermetically bonded to an outer surface of the sidewall of the package body. A metal hermetic seal washer surrounds the high-current I/O terminal and is bonded to a second surface of the ceramic seal and bonded to a portion of the high-current I/O terminal that passes through the metal hermetic seal washer.

Abstract: A silicon carbide semiconductor assembly and a method of forming a silicon carbide (SiC) semiconductor assembly are provided. The silicon carbide semiconductor assembly includes a semiconductor substrate and an electrode. The semiconductor substrate is formed of silicon carbide and includes a first surface, a second surface opposing the first surface, and a thickness extending therebetween. The method includes forming one or more electronic devices on the first surface and thinning the semiconductor substrate by removing the second surface to a predetermined depth of semiconductor substrate and leaving a third surface opposing the first surface. The method further includes forming a non-ohmic alloy layer on the third surface at a first temperature range and annealing the alloy layer at a second temperature range forming an ohmic layer, the second temperature range being greater than the first temperature range.

Abstract: A distributed amplifier system constituted of: an input transmission line exhibit a plurality of sections; an output transmission line; an amplifier stage, an output of the amplifier stage coupled to the output transmission line and an input of the amplifier stage coupled to the input transmission line between a respective pair of the plurality of sections; a PIN diode coupled between a first end of the input transmission line and a common potential; and a circuitry coupled between a second end of the input transmission line and the common potential, the second end opposing the first end, such that there is a direct current (DC) flow through the first unidirectional electronic valve, the input transmission line and the circuitry.

Abstract: An angular rotation sensor system constituted of: a first target with a member radially extending from, and rotating about a longitudinal axis of the first target; a second target with a member radially extending from, and rotating about a longitudinal axis of the second target; a first receive coil comprising a plurality of loops laid out such that adjacent loops exhibit opposing magnetic polarities responsive to a radio frequency current injected into the transmit coil; a second receive coil comprising a plurality of loops laid out such that adjacent loops exhibit opposing magnetic polarities responsive to a radio frequency current injected into the transmit coil; and an output coupled to each of the first and second receive coils, wherein each of the members is shaped and sized to generally match a shape and size of a pair of loops.

Abstract: A semiconductor device constituted of: a semiconductor layer; and a field layer patterned on said semiconductor layer, said field layer constituted of material having characteristics which block diffusion of mobile ions and maintain structural integrity at activation temperatures of up to 1200 degrees centigrade.

Abstract: A module package can include a substrate; at least one device component configured to be positioned on the substrate; a module package lid configured to be positioned over the at least one device component and on the substrate, the module package lid exhibiting a plateau portion; and at least one mounting spring configured to be positioned on the module package lid, wherein the at least one mounting spring is configured to be mechanically coupled with a mounting surface and further positionally secure the module package lid and the at least one device component. Each mounting spring can include a middle portion; an end portion having a mounting hole; and a curved section between the middle portion and the end portion, the middle portion arranged to mate with the plateau portion of the module package lid when the end portion are secured to the substrate, the curved section being configured to prevent contact with a first corner portion of the module package lid.

Abstract: An angular position sensor comprising at least one planar excitation coil and at least two planar sensing coils positioned within an interior of the at least one planar excitation coil, each of the at least two planar sensing coils comprising a clockwise winding portion positioned opposite a counter-clockwise winding portion and a rotatable inductive coupling element comprising a sector aperture, the rotatable inductive coupling element positioned in overlying relation to the at least one planar excitation coil and separated from the at least one planar excitation coil by an air gap.

Abstract: An apparatus can include a first planar inductive sensor including two oscillator coils and two sensing coils. The apparatus can also include a second planar inductive sensor independent of the first sensor and also including a pair of oscillator and sensing coils. The apparatus can further include a high frequency alternating current carrier generator configured to inject high frequency alternating current carrier signals into the oscillator coils. The carrier signal for the oscillator coil of the first planar inductive sensor is 180 degrees out of phase with a 2nd oscillator coil of the same planar inductive sensor, and wound in an opposite geometric direction, and the oscillator coils of the other inductive sensor can also be wound similarly The two sensing coils of the first planar inductive sensor can be 90 degrees out of phase with each another, and the sensing coils of the other inductive sensor can also be wound similarly.

Abstract: An angular rotation sensor system constituted of: an input shaft target and an output shaft target each comprising a plurality of members parallel to a longitudinal axis of an input shaft or output shaft; a gear target with an angular velocity exhibiting a predetermined ratio with an angular velocity of the input shaft, the gear target comprising a plurality of members, each extending away from the input shaft and orthogonal to a plane which is parallel to the longitudinal axis of the input shaft; and a control circuitry arranged to: determine an angular position of the input shaft responsive to a sensed angular rotation of the input shaft target and a sensed angular rotation of the gear target; and determine the amount of torque applied to the input shaft responsive to the sensed angular rotation of the input shaft target and a sensed angular rotation of the output shaft target.

Abstract: A voltage regulator includes an input terminal, an output terminal, a control circuitry, a buck mode switching converter, and a low dropout regulator circuit. The buck mode switching converter is arranged to convert a voltage signal received at the input terminal to a first voltage signal at the output terminal responsive to a first predetermined signal output from the control circuitry. The buck mode switching converter includes an electronically controlled switch in communication with an energy storage element. The low dropout regulator circuit is coupled between the input terminal and the output terminal and includes a linear circuit and is arranged to control a voltage drop across the linear circuit so as to provide a second voltage signal at the output terminal responsive to a second predetermined signal output from the control circuitry.