Patents Assigned to MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC
  • Patent number: 11300498
    Abstract: A sensor, method, and system for sensing corrosion. The sensor may be used to monitor the integrity of structural elements. The sensor, method, and system utilizing an inductive element formed on the substrate and having a first inductive loop and a second inductive loop. The sensor also includes a sensing element electrically connecting one end of the first inductive loop to an opposing end of the second inductive loop. Prior to dissolution of the sensing element, an inductance of the inductive element comprises a first inductance set by the first predetermined number of turns of the inductor coil having a first resonant frequency. After dissolution of the sensing element, the inductance of the inductive element comprises a second inductance reduced from the first inductance.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: April 12, 2022
    Assignee: Micross Advanced Interconnect Technology LLC
    Inventor: Scott Goodwin
  • Patent number: 10845297
    Abstract: A corrosion sensor system includes one or more corrosion sensors embedded in a coating material such as an anti-corrosion coating material. Each corrosion sensor may include a resonator disposed on a dielectric substrate, and has a resonant frequency in a radio frequency (RF) range or an infrared (IR) range, and is configured for interacting with an RF or IR excitation signal to produce an RF or IR measurement signal. The corrosion sensor system may be applied to an object for which corrosion is to be monitored. A corrosion detection system includes a data acquisition system that transmits the excitation signal to the corrosion sensor, and receives the measurement signal from the corrosion sensor for analysis to determine whether corrosion has occurred.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: November 24, 2020
    Assignee: MICROSS ADVANCED INTERCONNECT TECHNOLOGY, LLC
    Inventors: Scott Goodwin, Mark Roberson, John Lewis, Dorota Temple
  • Patent number: 10418344
    Abstract: An electronic package includes an adhesion layer between a first substrate and a second substrate. The adhesion layer is patterned to define openings aligned with through-substrate interconnects and corresponding bond pads. A conductive plane is formed between the first substrate and the second substrate, adjacent to the adhesion layer.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: September 17, 2019
    Assignee: Micross Advanced Interconnect Technology LLC
    Inventors: Erik Paul Vick, Dorota Temple
  • Patent number: 10209175
    Abstract: A corrosion sensor system includes one or more corrosion sensors embedded in a coating material such as an anti-corrosion coating material. Each corrosion sensor may include a resonator disposed on a dielectric substrate, and has a resonant frequency in a radio frequency (RF) range or an infrared (IR) range, and is configured for interacting with an RF or IR excitation signal to produce an RF or IR measurement signal. The corrosion sensor system may be applied to an object for which corrosion is to be monitored. A corrosion detection system includes a data acquisition system that transmits the excitation signal to the corrosion sensor, and receives the measurement signal from the corrosion sensor for analysis to determine whether corrosion has occurred.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: February 19, 2019
    Assignee: Micross Advanced Interconnect Technology LLC
    Inventors: Scott Goodwin, Mark Roberson, John Lewis, Dorota Temple
  • Patent number: 10125599
    Abstract: Systems and methods for determining the location of sensors embedded in material surrounding a well. In an example system, at least one seismic signal generator is configured to generate a seismic wave signal to communicate information that enables the determination of the sensor location to the sensor. A sensor location apparatus is provided and configured to lower the at least one seismic signal generator into the subsurface structure. A sensor location controller is provided in the sensor location apparatus and configured to actuate generation of the seismic wave signal as the at least one seismic signal generator is lowered into the well.
    Type: Grant
    Filed: August 1, 2013
    Date of Patent: November 13, 2018
    Assignee: MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC
    Inventor: Scott Goodwin