Patents Assigned to MiniLogic Device Corporation Ltd.
  • Patent number: 9072321
    Abstract: An electronic smoke comprising an inhale detector and a smoke effect generating circuitry. The inhale detector comprises an air-flow sensor which is arranged to detect direction and rate of air flow through the smoke apparatus, and the smoke effect generating circuitry is arranged to operate the smoke effect generating circuitry to generate smoking effect when the air flow direction corresponds to inhaling through the apparatus and the air flow rate reaches at predetermined threshold. Such an electronic smoke alleviates the problem of inadvertent triggering due to environmental vibration or noise or children playing by blowing into the device.
    Type: Grant
    Filed: June 29, 2010
    Date of Patent: July 7, 2015
    Assignee: MINILOGIC DEVICE CORPORATION LTD.
    Inventor: Loi Ying Liu
  • Publication number: 20120186594
    Abstract: An electronic smoke comprising an inhale detector and a smoke effect generating circuitry. The inhale detector comprises an air-flow sensor which is arranged to detect direction and rate of air flow through the smoke apparatus, and the smoke effect generating circuitry is arranged to operate the smoke effect generating circuitry to generate smoking effect when the air flow direction corresponds to inhaling through the apparatus and the air flow rate reaches at predetermined threshold. Such an electronic smoke alleviates the problem of inadvertent triggering due to environmental vibration or noise or children playing by blowing into the device.
    Type: Application
    Filed: June 29, 2010
    Publication date: July 26, 2012
    Applicant: Minilogic Device Corporation Ltd.
    Inventor: Loi Ying Liu
  • Patent number: 7125746
    Abstract: An electronic device including a multi-chip die and a substrate member, said multi-chip die includes a plurality of integrated circuit chips which are integrally formed on the multi-chip die as a unitary member, each the integrated chip includes a plurality of electrodes for making external electrical contacts, the substrate member includes a circuit of a pre-determined pattern and a plurality of electric contacts disposed for making corresponding electrical connections with the electrodes of the integrated chips of the multi-chip die, the plurality of integrated circuit chips of the multi-chip die being connected as a unitary member to the substrate member.
    Type: Grant
    Filed: November 5, 2004
    Date of Patent: October 24, 2006
    Assignee: MiniLogic Device Corporation Ltd.
    Inventor: Kwei Chung Li
  • Publication number: 20050093126
    Abstract: An electronic device including a multi-chip die and a substrate member, said multi-chip die includes a plurality of integrated circuit chips which are integrally formed on the multi-chip die as a unitary member, each the integrated chip includes a plurality of electrodes for making external electrical contacts, the substrate member includes a circuit of a pre-determined pattern and a plurality of electric contacts disposed for making corresponding electrical connections with the electrodes of the integrated chips of the multi-chip die, the plurality of integrated circuit chips of the multi-chip die being connected as a unitary member to the substrate member.
    Type: Application
    Filed: November 5, 2004
    Publication date: May 5, 2005
    Applicant: MiniLogic Device Corporation Ltd.
    Inventor: Kwei Li
  • Patent number: 6831355
    Abstract: An electronic device including a multi-chip die and a substrate member, said multi-chip die includes a plurality of integrated circuit chips which are integrally formed on the multi-chip die as a unitary member, each the integrated chip includes a plurality of electrodes for making external electrical contacts, the substrate member includes a circuit of a pre-determined pattern and a plurality of electric contacts disposed for making corresponding electrical connections with the electrodes of the integrated chips of the multi-chip die, the plurality of integrated circuit chips of the multi-chip die being connected as a unitary member to the substrate member.
    Type: Grant
    Filed: December 4, 2002
    Date of Patent: December 14, 2004
    Assignee: MiniLogic Device Corporation Ltd.
    Inventor: Kwei Chung Li